參數(shù)資料
型號: KFG1G16Q2M-DEB
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: FLASH MEMORY
中文描述: 閃存
文件頁數(shù): 77/125頁
文件大?。?/td> 1632K
代理商: KFG1G16Q2M-DEB
OneNAND1G(KFG1G16Q2M-DEB6)
FLASH MEMORY
77
OneNAND2G(KFH2G16Q2M-DEB6)
OneNAND4G(KFW4G16Q2M-DEB6)
When the CE or OE input is at V
IH
, output from the device is disabled.
The outputs are placed in the high impedance state.
The Program operation is used to program data from the on-chip BufferRAMs into the NAND FLASH memory array.
The device has two 2KB data buffers, each 1 Page (2KB + 64B) in size. Each page has 4 sectors of 512B each main area and 16B
spare area. The device can be programmed in units of 1~4 sectors.
The architecture of the DataRAMs permits a simultaneous data-write operation from the Host to one of data buffers and a program
operation from the other data buffer to the NAND Flash Array memory. Refer to Section 3.12.2, "Write While Program Operation", for
more information.
3.8 Program Operation
See Timing Diagram 6.9
Within a block, the pages must be programmed consecutively from the LSB (least significant bit) page of the block to MSB (most sig-
nificant bit) pages of the block. Random page address programming is prohibited.
From the LSB page to MSB page
DATA IN: Data (1)
Data (64)
(1)
(2)
(3)
(32)
(64)
Data register
Page 0
Page 1
Page 2
Page 31
Page 63
Ex.) Random page program (Prohibition)
DATA IN: Data (1)
Data (64)
(2)
(32)
(3)
(1)
(64)
Data register
Page 0
Page 1
Page 2
Page 31
Page 63
Addressing for program operation
:
:
:
:
3.7.4 Output Disable Mode Operation
相關(guān)PDF資料
PDF描述
KFG1G16Q2M-DED FLASH MEMORY
KFG1G16Q2M-DIB FLASH MEMORY
KFG1G16Q2M-DID FLASH MEMORY
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KFG2816U1M-DEB OneNAND SPECIFICATION
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