參數(shù)資料
型號(hào): KFG1G16Q2M-DIB
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: FLASH MEMORY
中文描述: 閃存
文件頁數(shù): 101/125頁
文件大?。?/td> 1632K
代理商: KFG1G16Q2M-DIB
OneNAND1G(KFG1G16Q2M-DEB6)
FLASH MEMORY
101
OneNAND2G(KFH2G16Q2M-DEB6)
OneNAND4G(KFW4G16Q2M-DEB6)
Note 1. CE should be VIH for RDY. IOBE should be ’0’ for INT.
Note 2. Icc active for Host access
Note 3. ICC active for Internal operation. (without host access)
Note 4. Vccq is equivalent to Vcc-IO
Parameter
Symbol
Test Conditions
1.8V device
Unit
Min
Typ
Max
Input Leakage Current
I
LI
V
IN
=V
SS
to V
CC
, V
CC
=V
CCmax
Single
- 1.0
-
+ 1.0
μ
A
DDP
-2.0
-
+ 2.0
QDP
-4.0
-
+ 4.0
Output Leakage Current
I
LO
V
OUT
=V
SS
to V
CC
, V
CC
=V
CCmax
,
CE or OE=V
IH
(Note 1)
Single
- 1.0
-
+ 1.0
μ
A
DDP
-2.0
-
+ 2.0
QDP
-4.0
-
+ 4.0
Active Asynchronous Read Cur-
rent (Note 2)
I
CC1
CE=V
IL
, OE=V
IH
-
8
15
mA
Active Burst Read Current (Note
2)
I
CC2
CE=V
IL
, OE=V
IH
66Mhz
-
15
25
mA
1MHz
-
3
4
mA
66Mhz
(DDP/
QDP)
-
20
25
mA
1MHz
(DDP/
QDP)
-
3
4
mA
Active Write Current (Note 2)
I
CC3
CE=V
IL
, OE=V
IH
Single
-
8
15
mA
DDP
-
13
20
mA
Active Load Current (Note 3)
I
CC4
CE=V
IL
, OE=V
IH
, WE=V
IH
-
30
40
mA
Active Program Current (Note 3)
I
CC5
CE=V
IL
, OE=V
IH
, WE=V
IH
-
25
30
mA
Active Erase Current (Note 3)
I
CC6
CE=V
IL
, OE=V
IH
, WE=V
IH
-
20
25
mA
Multi Block Erase Current (Note
3)
I
CC7
CE=V
IL
, OE=V
IH
, WE=V
IH
, 64blocks
-
20
25
mA
Standby Current
I
SB
CE= RP=V
CC
±
0.2V
Single
-
10
50
μ
A
DDP
-
20
100
QDP
-
40
180
Input Low Voltage
V
IL
-
-0.5
-
0.4
V
Input High Voltage (Note4)
V
IH
-
V
CCq
-0.4
-
V
CCq
+0.4
V
Output Low Voltage
V
OL
I
OL
= 100
μ
A , V
CC
=V
CCmin
, V
CCq
=V
CCqmin
-
-
0.2
V
Output High Voltage
V
OH
I
OH
= -100
μ
A , V
CC
=V
CCmin
, V
CCq
=V
CCqmin
V
CCq
-0.1
-
-
V
4.3 DC Characteristics
相關(guān)PDF資料
PDF描述
KFG1G16Q2M-DID FLASH MEMORY
KFG2816D1M-PID OneNAND SPECIFICATION
KFG2816U1M-DEB OneNAND SPECIFICATION
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KFG2816U1M-DIB OneNAND SPECIFICATION
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