KS8695P Micrel Electrical Characteristics(5) Symbol Parameter" />
參數(shù)資料
型號: KS8695P-EVAL
廠商: Micrel Inc
文件頁數(shù): 28/40頁
文件大?。?/td> 0K
描述: BOARD EVAL EXPERIMENT KS8695P
標準包裝: 1
其它名稱: 576-1002
August 2005
34
M9999-081805
KS8695P
Micrel
Electrical Characteristics(5)
Symbol
Parameter
Condition
Min
Typ
Max
Units
Total Supply Current (including TX output driver current)
100BASE-TX Operation: All ports 100% Utilization, SDOCLK = 125MHz
ITX
100BASE-TX (Analog TX)
VDDA3.3 = +3.3V
0.032
A
IRX
100BASE-TX (Analog RX)
VDDA1.8 = +1.8V
0.072
A
IDDIO
100BASE-T (Digital I/O)
VDD3.3 = +3.3V
0.033
A
IDDC
100BASE-T (Digital Core)
VDD1.8 = +1.8V
0.235
A
10BASE-TX Operation: All ports 100% Utilization, SDOCLK = 125MHz
ITX
10BASE-T (Analog TX)
VDDA3.3 = +3.3V
0.030
A
IRX
10BASE-T (Analog RX)
VDDA1.8 = +1.8V
0.072
A
IDDIO
10BASE-T (Digital I/O)
VDD3.3 = +3.3V
0.025
A
IDDC
10BASE-T (Digital Core)
VDD1.8 = +1.8V
0.234
A
Auto-Negotiation Mode: SDOCLK = 125MHz
ITX
10BASE-T (Analog TX)
VDDA3.3 = +3.3V
0.032
A
IRX
10BASE-T (Analog RX)
VDDA1.8 = +1.8V
0.07
A
IDDIO
10BASE-T (Digital I/O)
VDD3.3 = +3.3V
0.021
A
IDDC
10BASE-T (Digital Core)
VDD1.8 = +1.8V
0.233
A
TTL Inputs (PCI, LED, Memory Interface, UART)
VIH
Input High Voltage
2.0
V
VIL
Input Low Voltage
0.8
V
IIN
Input Current
(Excluding pull-up/pull-down)
VIN = GND ~ VDD3.3
–10
10
A
TTL Outputs (PCI, LED, Memory Interface, UART)
VOH
Output High Voltage
IOH = –8mA; VDD3.3
2.4
V
VOL
Output Low Voltage
IOL = 8mA
0.7
V
IOZ
Output Tri-state Leakage
10
A
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guara
to VDD).
3. VDDA or VDD can operate from either a 2.5V or 3.3V supply.
4. No heat spreader in package.
5. Specication for packaged product only.
Absolute Maximum Ratings(1)
Supply Voltage
(VDDA1.8, VDD1.8) ......................................–0.5V to +2.4V
(VDDA3.3, VDD3.3) ......................................–0.5V to +4.0V
Input Voltage (all inputs)...............................–0.5V to +4.0V
Output Voltage (all outputs)..........................–0.5V to +4.0V
Lead Temperature (soldering, 10sec.)....................... 270°C
Pb (Lead) Free Temperature (soldering, 10sec)........ 260°C
Storage Temperature (TS) ........................ –55°C to +150°C
Operating Ratings(2)
Supply Voltage
(VDDA1.8, VDD1.8....................................... +1.7V to +1.9V
(VDDA3.3, VDD3.3)(3).................................. +3.0V to +3.6V
Ambient Temperature (TA)............................ –0°C to +70°C
Junction Temperature (TJ)......................................... 150°C
Package Thermal Resistance(4)
PBGA (θJA) No Air Flow ..........................................29.86°C/W
1m/s..............................................21.86°C/W
2m/s.............................................21.54°C/W
JC) No Air Flow.............................................8.34°C/W
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