參數(shù)資料
型號(hào)： L6460TR
廠商： STMICROELECTRONICS
元件分類： 運(yùn)動(dòng)控制電子
英文描述： STEPPER MOTOR CONTROLLER, PQFP64
封裝： 10 X 10 MM, 1 MM HEIGHT, ROHS COMPLIANT, TQFP-64
文件頁數(shù)： 35/139頁
文件大小： 3837K
代理商： L6460TR
L6460
General description
Doc ID 17713 Rev 1
13/139
35
GPIO12
General purpose I/O
Analog In/Out - CMOS bi-dir
36
GPIO13
General purpose I/O
Analog In/Out - CMOS bi-dir
37
GPIO14
General purpose I/O
Analog In/Out - CMOS bi-dir
38
N.C.
Not connected
39
DC4_MINUS Bridge 4 phase “minus” output
Output
40
DC4_SENSE Bridge 4 sense output(4)
Output
41
DC3_SENSE Bridge 3 sense output(4)
Output
42
DC3_MINUS Bridge 3 phase “minus” output
Output
43
N.C.
Not connected
44
GPIO11
General purpose I/O
Analog In/Out - CMOS bi-dir
45
GPIO10
General purpose I/O
Analog In/Out - CMOS bi-dir
46
GPIO9
General purpose I/O
Analog In/Out - CMOS bi-dir
47
GPIO5
General purpose I/O
Analog In/Out - CMOS bi-dir
48
DC3_SENSE Bridge 3 sense output(4)
Output
49
N.C.
Not connected
50
DC3_PLUS
Bridge 3 phase “plus” output
Output
51
VSupply
Main voltage supply
Power input
52
nRESET
Open drain system reset pin
CMOS Input/output
53
V3v3
Internal 3.3 volt regulator
Power Input/output
54
VSupplyInt
Internal voltage supply
Power Input
55
GPIO7
General purpose I/O
Analog In/Out - CMOS bi-dir
56
VGPIO_SPI
Low voltage pins power supply
Power input
57
GPIO6
General purpose I/O
Analog In/Out - CMOS bi-dir
58
VSWDRV_SW Switching regulator controller source input
Power input
59
VSWDRV_GATE Switching driver gate drive pin
Analog output
60
VPump
Charge pump voltage
Power Input/output
61
CPH
Charge pump high switch pin
Power Input/output
62
CPL
Charge pump low switch pin
Power Input/output
63
VSupply
Main voltage supply
Power input
64
DC1_plus
Bridge 1 phase “plus” output
Output
E_Pad
GND_PAD
1.
These pins must be connected all together to a unique PCB ground.
2.
Bridges1 and 2 have 2 ground pads: one is bonded to the relative ground pin (GND1 or GND2) and the
other is connected to exposed pad (E_Pad) ground ring. This makes the bond wires testing possible by
forcing a current between E-Pad and GND1 or GND2 pins and using the other pin as sense pin to measure
the resistance of E-Pad bonding. (N.B: grounds of two bridges are internally connected together).
3.
The analog ground is connected to exposed pad E-Pad.
4.
The pin must be tied to ground if bridge is not used as a stepper motor.
Table 2.
Pins configuration (continued)
Pin #
Pin name
Description
Type
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