SPI/I2C UART with 128-Word FIFOs Stresses beyond those listed under “Absolute Ma" />
參數(shù)資料
型號(hào)： MAX3107EAG+T
廠商： Maxim Integrated Products
文件頁(yè)數(shù)： 49/52頁(yè)
文件大小： 0K
描述： IC UART SPI/I2C 128 FIFO 24SSOP
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 1
特點(diǎn)： 內(nèi)部振蕩器
通道數(shù)： 4，QUART
FIFO's： 128 字節(jié)
規(guī)程： RS232，RS485
電源電壓： 2.35 V ~ 3.6 V
帶自動(dòng)流量控制功能： 是
帶IrDA 編碼器/解碼器： 是
帶故障啟動(dòng)位檢測(cè)功能： 是
安裝類型： 表面貼裝
封裝/外殼： 24-SSOP（0.209"，5.30mm 寬）
供應(yīng)商設(shè)備封裝： 24-SSOP
包裝： 標(biāo)準(zhǔn)包裝
其它名稱： MAX3107EAG+TDKR
SPI/I2C UART with 128-Word FIFOs
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to AGND.)
VL, VA, VEXT, XIN ................................................ -0.3V to +4.0V
V18, XOUT .................................................. -0.3V to (VA + 0.3V)
RST, IRQ, DIN/A1, CS/A0, SCLK/SCL,
DOUT/SDA, LDOEN, I2C/SPI.................. -0.3V to (VL + 0.3V)
TX, RX, RTS/CLKOUT, CTS, GPIO_....... -0.3V to (VEXT + 0.3V)
DGND.................................................................. -0.3V to +0.3V
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 15.4mW/NC above +70NC) ................. 1229mW
SSOP (derate 12.3mW/NC above +70NC) ................... 988mW
Operating Temperature Range ........................ -40NC to +85NC
Junction Temperature ................................................... +150NC
Storage Temperature Range........................... -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
DC ELECTRICAL CHARACTERISTICS
(VA = +2.35V to +3.6V, VL = +1.71V to +3.6V, VEXT = +1.71V to +3.6V, TA = -40NC to +85NC, unless otherwise noted. Typical values
are at VA = +2.8V, VL = +1.8V, VEXT = +2.5V, TA = +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
TQFN
Junction-to-Ambient Thermal Resistance (BJA).......... 65NC/W
Junction-to-Case Thermal Resistance (BJC)............... 15NC/W
SSOP
Junction-to-Ambient Thermal Resistance (BJA)...........81NC/W
Junction-to-Case Thermal Resistance (BJC)............... 32NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Digital Interface Supply Voltage
VL
1.71
3.6
V
Analog Supply Voltage
VA
2.35
3.6
V
UART Interface Logic Supply
Voltage
VEXT
1.71
3.6
V
Logic Supply Voltage
V18
1.65
1.80
1.95
V
CURRENT CONSUMPTION
VA Supply Current
IA
1.8MHz crystal oscillator active, PLL dis-
abled, VLDOEN = VL, SPI/I2C interface idle
220
500
F
A
Baud rate = 1Mbps, external clock, SPI
frequency is 8MHz, external loopback PLL
disabled, VLDOEN = VL (Note 3)
0.65
1.3
mA
VA Shutdown Supply Current
IA, SHDN
Shutdown mode, VLDOEN = 0V, VRST = 0V,
all inputs and outputs are idle
20
35
F
A
VA Sleep Supply Current
IA, SLEEP
Sleep mode, VLDOEN = VL, VRST = VL, all
inputs and outputs are idle
45
100
F
A
VL Supply Current
IL
All logic inputs are at VL or VEXT or 0V
4
15
F
A
VEXT Supply Current
IEXT
All logic inputs are at VL or VEXT or 0V
5
10
F
A
V18 Input Power-Supply Current
in Shutdown Mode
I18SHDN
VLDOEN = 0V (V18 is powered by an exter-
nal 1.85V voltage source), static power
consumption
7
50
F
A
6
Maxim Integrated
MAX3107
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