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參數(shù)資料
| 型號： | MPC5200B |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 英文描述： | SDRAM/DDR Memory Controller |
| 中文描述： | 內存/ DDR存儲器控制器 |
| 文件頁數(shù)： | 11/78頁 |
| 文件大?。?/td> | 629K |
| 代理商： | MPC5200B |
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Electrical and Thermal Characteristics
MPC5200B Data Sheet, Rev. 1
Freescale Semiconductor
11
3.1.6
Thermal Characteristics
3.1.6.1
An estimation of the chip-junction temperature, T
J
, can be obtained from the following equation:
Heat Dissipation
T
J
= T
A
+(R
θ
JA
×
P
D
)
Eqn. 3
where:
T
A
= ambient temperature for the package (oC)
R
θ
JA
= junction to ambient thermal resistance (oC/W)
P
D
= power dissipation in package (W)
The junction to ambient thermal resistance is an industry standard value, which provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single layer board, and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is correct depends on the power
dissipated by other components on the board. The value obtained on a single layer board is appropriate for
the tightly packed printed circuit board. The value obtained on the board with the internal planes is usually
appropriate if the board has low power dissipation and the components are well separated.
Table 7. Thermal Resistance Data
Rating
Board Layers
Sym
Value
Unit
Notes
SpecID
Junction to Ambient
Natural Convection
Single layer board
(1s)
R
θ
JA
30
°C/W
(1),(2)
NOTES:
1
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance.
2
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3
Per JEDEC JESD51-6 with the board horizontal.
4
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
6
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
D6.1
Junction to Ambient
Natural Convection
Four layer board (2s2p)
R
θ
JMA
22
°C/W
(1),(3)
D6.2
Junction to Ambient (@200
ft/min)
Single layer board
(1s)
R
θ
JMA
24
°C/W
(1),(3)
D6.3
Junction to Ambient (@200
ft/min)
Four layer board
(2s2p)
R
θ
JMA
19
°C/W
(1),(3)
D6.4
Junction to Board
R
θ
JB
14
°C/W
(4)
D6.5
Junction to Case
R
θ
JC
Ψ
JT
8
°C/W
(5)
D6.6
Junction to Package Top
Natural Convection
2
°C/W
(6)
D6.7
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC5200B_08 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:SDRAM / DDR Memory Controller |
| MPC5200B_10 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:SDRAM/DDR Memory Controller |
| MPC5200BDS | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Technical Data |
| MPC5200BV400 | 功能描述:微處理器 - MPU 400MHz 760MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC5200CBV266 | 功能描述:微處理器 - MPU 266MHz 760MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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