參數(shù)資料
型號(hào): MPC5553MZP132
廠商: Freescale Semiconductor
文件頁數(shù): 61/68頁
文件大?。?/td> 0K
描述: IC MCU MPC5553 REV A 416-PBGA
產(chǎn)品培訓(xùn)模塊: MPC55xx PitchPak Family
標(biāo)準(zhǔn)包裝: 200
系列: MPC55xx Qorivva
核心處理器: e200z6
芯體尺寸: 32-位
速度: 132MHz
連通性: CAN,EBI/EMI,以太網(wǎng),SCI,SPI
外圍設(shè)備: DMA,POR,PWM,WDT
輸入/輸出數(shù): 220
程序存儲(chǔ)器容量: 1.5MB(1.5M x 8)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 64K x 8
電壓 - 電源 (Vcc/Vdd): 1.35 V ~ 1.65 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 40x12b
振蕩器型: 外部
工作溫度: -40°C ~ 125°C
封裝/外殼: 416-BBGA
包裝: 托盤
配用: MPC5553EVBISYS-ND - KIT EVAL ISYSTEMS MPC5553
MPC5553EVBGHS-ND - KIT EVAL GREEN HILLS SOFTWARE
MPC5553EVB-ND - KIT EVAL MPC5553MZP132
MPC5553EVBE-ND - BOARD EVAL FOR MPC5553
MPC5553 Microcontroller Data Sheet, Rev. 4
Revision History for the MPC5553 Data Sheet
Freescale Semiconductor
64
Changed title to Pin Status for Fast Pads During the Power Sequence
Changed preceding paragraph
From:
Although there are no power up/down sequencing requirements to prevent issues like latch-up, excessive current
spikes, etc., the state of the I/O pins during power up/down varies depending on power. Prior to exiting POR, the
pads are in a high impedance state (Hi-Z).
To:
There are no power up/down sequencing requirements to prevent issues such as latch-up, excessive current
spikes, and so on. Therefore, the state of the I/O pins during power up/down varies depending on which supplies
are powered.
Changed title to Pin Status for Medium and Slow Pads During the Power Sequence
Updated preceding paragraph.
Spelled the slash ‘/’ as ‘a(chǎn)nd’ as well as ‘I/O’ as ‘input/output.’ Still very confusing. Deleted ‘input/output’.
Added footnote that reads: VDDE2 and VDDE3 are limited to 2.25–3.6 V only if EBTS = 0; VDDE2 and VDDE3 have
a range of 1.6–3.6 V if EBTS =1.
Spec 20, column 2, Characteristics,’ Slow and medium output high voltage (IOH_S = –2.0 mA):’
Created a left-justified second line and moved ‘IOH_S = –2.0 mA’ from the 1st line to the second line and deleted
the parentheses. Created a left-justified third line that reads ‘IOH_S = –1.0 mA.’
Spec 20, column 4, Min.: Added a blank line before and after ‘0.80
V
DDEH’ and put ‘0.85 VDDEH’ on the last
line.
Spec 22, column 2,’Slow and medium output low voltage (IOL_S = 2.0 mA):’ Created a left-justified second line
and moved ‘IOL_S = 2.0 mA.’ from the 1st line to the second line and deleted the parentheses. Created a
left-justified third line that reads ‘IOL_S = 1.0 mA.’ Column 5, Max: Added a blank line before and after ‘0.20
VDDEH’ and put ‘0.15 VDDEH’ on the last line.
Spec 26: Changed ‘AN[12]_MA[1]_SDO’ to ‘AN[13]_MA[1]_SDO’.
Spec 27a: Operating current 1.5 V supplies @ 132 MHz changed to:
1.65 typical = 460
1.35 typical = 360
1.65 high = 510
1.35 high = 410
Spec 27b, Operating current 1.5 V supplies @ 114 MHz changed to:
1.65 typical = 410
1.35 typical = 310
1.65 high = 460
1.35 high = 370
Spec 27c, Operating current 1.5 V supplies @ 82 MHz changed to:
1.65 typical = 330
1.35 typical = 225
1.65 high = 385
1.35 high = 290
Spec 28: Changed 132 MHz to fMAX MHz.
Footnote 3 changed to read: If standby operation is not required, connect VSTBY to ground.
Footnote 6 is now: Figure 3 (Power-Up Sequence (VRC33 Grounded))shows an illustration of the IDD_STBY
values interpolated for these temperature values.
Deleted footnote 9: ‘Preliminary. Final specification pending characterization.’
Deleted duplicate footnote: ‘Absolute value of current, measured at VIL and VIH.
Table 33. Table and Figure Changes Between Rev. 2.0 and 3.0 (continued)
Location
Description of Changes
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