參數(shù)資料
型號: MPC5553MZP132
廠商: Freescale Semiconductor
文件頁數(shù): 68/68頁
文件大小: 0K
描述: IC MCU MPC5553 REV A 416-PBGA
產(chǎn)品培訓(xùn)模塊: MPC55xx PitchPak Family
標(biāo)準(zhǔn)包裝: 200
系列: MPC55xx Qorivva
核心處理器: e200z6
芯體尺寸: 32-位
速度: 132MHz
連通性: CAN,EBI/EMI,以太網(wǎng),SCI,SPI
外圍設(shè)備: DMA,POR,PWM,WDT
輸入/輸出數(shù): 220
程序存儲器容量: 1.5MB(1.5M x 8)
程序存儲器類型: 閃存
RAM 容量: 64K x 8
電壓 - 電源 (Vcc/Vdd): 1.35 V ~ 1.65 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 40x12b
振蕩器型: 外部
工作溫度: -40°C ~ 125°C
封裝/外殼: 416-BBGA
包裝: 托盤
配用: MPC5553EVBISYS-ND - KIT EVAL ISYSTEMS MPC5553
MPC5553EVBGHS-ND - KIT EVAL GREEN HILLS SOFTWARE
MPC5553EVB-ND - KIT EVAL MPC5553MZP132
MPC5553EVBE-ND - BOARD EVAL FOR MPC5553
Electrical Characteristics
MPC5553 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
9
The thermal characterization parameter is measured in compliance with the JESD51-2 specification using
a 40-gauge type T thermocouple epoxied to the top center of the package case. Position the thermocouple
so that the thermocouple junction rests on the package. Place a small amount of epoxy on the thermocouple
junction and approximately 1 mm of wire extending from the junction. Place the thermocouple wire flat
against the package case to avoid measurement errors caused by the cooling effects of the thermocouple
wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Rd.
San Jose, CA., 95134
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive
Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applica-
tions,” Electronic Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and
Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.
3.3
Package
The MPC5553 is available in packaged form. Read the package options in Section 2, “Ordering
Information.” Refer to Section 4, “Mechanicals,” for pinouts and package drawings.
3.4
EMI (Electromagnetic Interference) Characteristics
Table 4. EMI Testing Specifications 1
1 EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03. Qualification testing was performed on the MPC5554
and applied to the MPC5500 family as generic EMI performance data.
Spec
Characteristic
Minimum
Typical
Maximum
Unit
1
Scan range
0.15
1000
MHz
2
Operating frequency
fMAX
MHz
3VDD operating voltages
1.5
V
4VDDSYN, VRC33, VDD33, VFLASH, VDDE operating voltages
3.3
V
5VPP, VDDEH, VDDA operating voltages
5.0
V
6
Maximum amplitude
14 2
32 3
2 Measured with the single-chip EMI program.
3 Measured with the expanded EMI program.
dBuV
7
Operating temperature
25
oC
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