參數(shù)資料
型號(hào): MPC603RZT266TX
廠商: MOTOROLA INC
元件分類(lèi): 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, PBGA255
封裝: 23 X 23 MM, 2.60 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255
文件頁(yè)數(shù): 11/36頁(yè)
文件大?。?/td> 440K
代理商: MPC603RZT266TX
PID7t-603e Hardware Specifications
19
Package Descriptions
1.7.1.2 Mechanical Dimensions of the CBGA Package
Figure 10 provides the mechanical dimensions and bottom surface nomenclature of the CBGA package.
Figure 10. Mechanical Dimensions and Bottom Surface Nomenclature of the CBGA Package
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2.
CONTROLLING DIMENSION: MILLIMETER.
0.200
F
T
255X
A
2X
A1 CORNER
P
N
0.200
2X
E
123456789 10 11 12 13 14 15 16
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
E
0.300
T
0.150
D
C
H
0.150 T
B
F
K
G
S
T
DIM
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
21.000 BSC
0.827 BSC
B
21.000 BSC
0.827 BSC
C
2.450
3.000
0.097
0.118
D
0.820
0.930
0.032
0.036
G
1.270 BSC
0.050 BSC
H
0.790
0.990
0.031
0.039
K
0.635 BSC
0.025 BSC
N
5.000
16.000
0.197
0.630
P
5.000
16.000
0.197
0.630
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