參數(shù)資料
型號: MPC603RZT266TX
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, PBGA255
封裝: 23 X 23 MM, 2.60 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255
文件頁數(shù): 15/36頁
文件大?。?/td> 440K
代理商: MPC603RZT266TX
22
PID7t-603e Hardware Specifications
Package Descriptions
Figure 12 shows the JEDEC package dimensions of the PBGA package.
Figure 12. Package Dimensions for the Plastic Ball Grid Array (PBGA)JEDEC Standard
Note that the pin numberings shown in Figure 12 do not match Table 11 and the pinout of the non-JEDEC
standard package (and the CBGA pinout) shown in Figure 11. Figure 11 should be used in conjunction with
Table 11 for the complete pinout description.
U
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
256X
BOTTOM VIEW
E
0.20
7
6
5
4
3
2
b
0.15
C
D
D2
E2
A
B
0.30
C AB
SIDE VIEW
DIM
MIN
MAX
MILLIMETERS
A
2.10
2.60
A1
0.50
0.70
A2
1.10
1.20
A3
0.50
0.70
b
0.60
0.90
D
23.00 BSC
D1
19.05 REF
D2
E
23.00 BSC
E1
19.05 REF
E2
19.40
19.60
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2.
DIMENSIONS IN MILLIMETERS.
3.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO
PRIMARY DATUM C.
4.
PRIMARY DATUM C AND THE SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
4X
8 9 10 11 12 13 14 15 16
M
TOP VIEW
(D1)
15X
e
15X
e
(E1)
4X
e /2
0.20 C
0.35 C
A3
256X
C
A
A1
A2
SEATING
PLANE
e
1.27 BSC
19.40
19.60
17
CASE 1167-01
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