參數(shù)資料
型號(hào)： MPC603RZT266TX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 266 MHz, RISC PROCESSOR, PBGA255
封裝： 23 X 23 MM, 2.60 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255
文件頁(yè)數(shù)： 14/36頁(yè)
文件大?。?/td> 440K
代理商： MPC603RZT266TX
PID7t-603e Hardware Specifications
21
Package Descriptions
1.7.2.2 Mechanical Dimensions of the PBGA Package
Figure 11 shows the non-JEDEC package mechanical dimensions and bottom surface nomenclature of the
the PBGA package.
Figure 11. Package Dimensions for the Plastic Ball Grid Array (PBGA)non-JEDEC Standard
Note that Table 11 lists the pinout to this non-JEDEC standard in order to be consistent with the CBGA
pinout.
T
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
256X
BOTTOM VIEW
E
0.20
6
5
4
3
2
1
b
0.15
C
D
D2
E2
A
B
0.30
C AB
SIDE VIEW
DIM
MIN
MAX
MILLIMETERS
A
2.10
2.60
A1
0.50
0.70
A2
1.10
1.20
A3
0.50
0.70
b
0.60
0.90
D
23.00 BSC
D1
19.05 REF
D2
E
23.00 BSC
E1
19.05 REF
E2
19.40
19.60
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2.
DIMENSIONS IN MILLIMETERS.
3.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO
PRIMARY DATUM C.
4.
PRIMARY DATUM C AND THE SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
4X
7 8 9 10 11 12 13 14 15
M
TOP VIEW
(D1)
15X
e
15X
e
(E1)
4X
e /2
0.20 C
0.35 C
A3
256X
C
A
A1
A2
SEATING
PLANE
e
1.27 BSC
19.40
19.60
16
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