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參數(shù)資料
| 型號： | MPC603RZT266TX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA255 |
| 封裝： | 23 X 23 MM, 2.60 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255 |
| 文件頁數(shù)： | 19/36頁 |
| 文件大?。?/td> | 440K |
| 代理商： | MPC603RZT266TX |
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PID7t-603e Hardware Specifications
System Design Information
Figure 14. Typical Die Junction-to-Ambient Thermal Resistance
(21 mm CBGA and 23 mm WB-PBGA)
To reduce the die-junction temperature, heat sinks may be attached to the package by several
methodsadhesive, spring clip to holes in the printed-circuit board or package, and mounting clip and
screw assembly (both CBGA and PGBA packages); see Figure 15. Caution: please note, when choosing a
heat sink attachment method, any attachment mechanism should not degrade the package structural integrity
and/or the package-to-board interconnect reliability. For additional general information, see this
paper--Investigation of Heat Sink Attach Methodologies and the Effects on Package Structural Integrity and
Interconnect Reliability.
Air flow Velocit y ( m/ s )
0
5
10
15
20
25
30
35
40
0
0 .5
1
1 .5
2
Typical Lower Limit
Typical Upper Limit
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