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參數(shù)資料
| 型號： | MPC603RZT266TX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA255 |
| 封裝： | 23 X 23 MM, 2.60 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255 |
| 文件頁數(shù)： | 21/36頁 |
| 文件大?。?/td> | 440K |
| 代理商： | MPC603RZT266TX |
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PID7t-603e Hardware Specifications
System Design Information
The board designer can choose between several types of heat sinks to place on the 603e. There are several
commercially-available heat sinks for the 603e provided by the following vendors:
Chip Coolers Inc.
800-227-0254 (USA/Canada)
333 Strawberry Field Rd.
401-739-7600
Warwick, RI 02887-6979
Internet: www.chipcoolers.com
International Electronic Research Corporation (IERC)818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Internet: www.ctscorp.com
Thermalloy
972-243-4321
2021 W. Valley View Lane
Dallas, TX 75234-8993
Internet: www.thermalloy.com
Wakeeld Engineering
781-406-3000
100 Cummings Center, Suite 157H
Beverly, MA 01915
Internet: www.wakeeld.com
Aavid Engineering
972-551-7330
250 Apache Trail
Terrell, TX 75160
Internet: www.aavid.com
Ultimately, the nal selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.8.6.1 Internal Package Conduction Resistance
For this packaging technology the intrinsic thermal conduction resistance (shown in Table 3) versus the
external thermal resistance paths are shown in Figure 16 for a package with an attached heat sink mounted
to a printed-circuit board.
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