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參數(shù)資料
| 型號： | MPC755 |
| 廠商： | Motorola, Inc. |
| 英文描述： | RISC Microprocessor Hardware Specifications |
| 中文描述： | RISC微處理器硬件規(guī)格 |
| 文件頁數(shù)： | 20/56頁 |
| 文件大?。?/td> | 1652K |
| 代理商： | MPC755 |
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MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
20
Freescale Semiconductor
Electrical and Thermal Characteristics
L2SYNC_IN to high impedance:
All outputs when L2CR[14–15] = 00
All outputs when L2CR[14–15] = 01
All outputs when L2CR[14–15] = 10
All outputs when L2CR[14–15] = 11
t
L2CHOZ
—
—
—
—
2.4
2.6
2.8
3.0
ns
3, 5
Notes:
1. Rise and fall times for the L2SYNC_IN input are measured from 20% to 80% of L2OV
DD
.
2. All input specifications are measured from the midpoint of the signal in question to the midpoint voltage of the rising edge of the input
L2SYNC_IN (see
Figure 8
). Input timings are measured at the pins.
3. All output specifications are measured from the midpoint voltage of the rising edge of L2SYNC_IN to the midpoint of the signal in question.
The output timings are measured at the pins. All output timings assume a purely resistive 50-
load (see
Figure 10
).
4. The outputs are valid for both single-ended and differential L2CLK modes. For pipelined registered synchronous BurstRAMs, L2CR[14–15]
= 01 or 10 is recommended. For pipelined late write synchronous BurstRAMs, L2CR[14–15] = 11 is recommended.
5. Guaranteed by design and characterization.
6. Revisions prior to Rev. 2.8 (Rev. E) were limited in performance and did not conform to this specification. For more information, refer to
Section 10.2, “Part Numbers Not Fully Addressed by This Document
.”
Table 12. L2 Bus Interface AC Timing Specifications (continued)
At recommended operating conditions (see
Table 3
)
Parameter
Symbol
All Speed Grades
Unit
Notes
Min
Max
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| MPC755BPX300LE | 功能描述:微處理器 - MPU 360PBGA RV2.8 HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BPX350LE | 功能描述:微處理器 - MPU 360PBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BRX300LE | 功能描述:微處理器 - MPU 360CBGARV2.8HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BRX350LE | 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BRX350TE | 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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