參數(shù)資料
型號： MPC755
廠商： Motorola, Inc.
英文描述： RISC Microprocessor Hardware Specifications
中文描述： RISC微處理器硬件規(guī)格
文件頁數(shù)： 46/56頁
文件大小： 1652K
代理商： MPC755
MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
46
Freescale Semiconductor
System Design Information
Figure 26. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
8.8.2
Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the thermal
contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 27
shows
the thermal performance of three thin-sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare
joint, and a joint with thermal grease as a function of contact pressure. As shown, the performance of these thermal
interface materials improves with increasing contact pressure. The use of thermal grease significantly reduces the
interface thermal resistance. That is, the bare joint results in a thermal resistance approximately seven times greater
than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 25
).
This spring force should not exceed 5.5 pounds of force. Therefore, the synthetic grease offers the best thermal
performance, considering the low interface pressure. Of course, the selection of any thermal interface material
depends on many factors—thermal performance requirements, manufacturability, service temperature, dielectric
properties, cost, etc.
External Resistance
(Note the internal versus external package resistance.)
External Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Die/Package
Die Junction
Internal Resistance
Package/Leads
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC755BPX300LE 功能描述:微處理器 - MPU 360PBGA RV2.8 HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BPX350LE 功能描述:微處理器 - MPU 360PBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BRX300LE 功能描述:微處理器 - MPU 360CBGARV2.8HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BRX350LE 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BRX350TE 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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