參數(shù)資料
型號(hào)： MPC755
廠商： Motorola, Inc.
英文描述： RISC Microprocessor Hardware Specifications
中文描述： RISC微處理器硬件規(guī)格
文件頁數(shù)： 48/56頁
文件大?。?/td> 1652K
代理商： MPC755
MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
48
Freescale Semiconductor
System Design Information
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
888-642-7674
888-246-9050
8.8.3
Heat Sink Selection Example
This section provides a heat sink selection example using one of the commercially-available heat sinks. For
preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
T
j
= T
a
+ T
r
+ (
θ
jc
+
θ
int
+
θ
sa
)
×
P
d
where:
T
j
is the die-junction temperature
T
a
is the inlet cabinet ambient temperature
T
r
is the air temperature rise within the computer cabinet
θ
jc
is the junction-to-case thermal resistance
θ
int
is the adhesive or interface material thermal resistance
θ
sa
is the heat sink base-to-ambient thermal resistance
P
d
is the power dissipated by the device
During operation the die-junction temperatures (T
j
) should be maintained less than the value specified in
Table 3
.
The temperature of air cooling the component greatly depends on the ambient inlet air temperature and the air
temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (T
a
) may range from 30°
to 40°C. The air temperature rise within a cabinet (T
r
) may be in the range of 5° to 10°C. The thermal resistance of
the thermal interface material (
θ
int
) is typically about 1°C/W. Assuming a T
a
of 30°C, a T
r
of 5°C, a CBGA package
R
θ
jc
< 0.1, and a power consumption (P
d
) of 5.0 W, the following expression for T
j
is obtained:
Die-junction temperature:
T
j
= 30°C + 5°C + (0.1°C/W + 1.0°C/W +
θ
sa
)
×
5.0 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
sa
) versus airflow velocity is
shown in
Figure 28
.
Assuming an air velocity of 0.5 m/s, we have an effective R
sa
of 7°C/W, thus
T
j
= 30°C + 5°C + (0.1°C/W + 1.0°C/W + 7°C/W)
×
5.0 W,
resulting in a die-junction temperature of approximately 76°C which is well within the maximum operating
temperature of the component.
Other heat sinks offered by Aavid Thermalloy, Alpha Novatech, The Bergquist Company, IERC, Chip Coolers, and
Wakefield Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need airflow.
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參數(shù)描述
MPC755BPX300LE 功能描述:微處理器 - MPU 360PBGA RV2.8 HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BPX350LE 功能描述:微處理器 - MPU 360PBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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MPC755BRX350LE 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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