參數(shù)資料
型號(hào): MPC755CRX400LE
廠商: Motorola, Inc.
英文描述: RISC Microprocessor Hardware Specifications
中文描述: RISC微處理器硬件規(guī)格
文件頁(yè)數(shù): 32/56頁(yè)
文件大?。?/td> 1652K
代理商: MPC755CRX400LE
MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
32
Freescale Semiconductor
Package Description
7.2
Mechanical Dimensions for the MPC745 PBGA
Figure 18
provides the mechanical dimensions and
bottom surface nomenclature for the MPC745, 255 PBGA
package.
Figure 18. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC745,
255 PBGA Package
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A METALIZED
FEATURE WITH VARIOUS SHAPES. BOTTOM
SIDE A1 CORNER IS DESIGNATED WITH A BALL
MISSING FROM THE ARRAY.
4. CAPACITOR PADS MAY BE UNPOPULATED.
Millimeters
DIM
Min
Max
A
2.25
2.80
A1
0.50
0.70
A2
1.00
1.20
A3
0.60
b
0.60
0.90
D
21.00 BSC
D1
6.75
E
21.00 BSC
E1
7.87
e
1.27 BSC
0.2
D
2X
A1 CORNER
E
0.2
B
A
C
0.2 C
B
C
C
255X
e
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A
0.3
0.15
b
E1
D1
A
A1
A2
A3
1
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