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參數(shù)資料
| 型號： | MPC755CRX400LE |
| 廠商： | Motorola, Inc. |
| 英文描述： | RISC Microprocessor Hardware Specifications |
| 中文描述： | RISC微處理器硬件規(guī)格 |
| 文件頁數(shù)： | 44/56頁 |
| 文件大小： | 1652K |
| 代理商： | MPC755CRX400LE |
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MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
44
Freescale Semiconductor
System Design Information
others use left-to-right then top-to-bottom, while still others number the pins counter clockwise from pin 1 (as with
an IC). Regardless of the numbering, the signal placement recommended in
Figure 25
is common to all known
emulators.
The QACK signal shown in
Figure 24
is usually connected to the PCI bridge chip in a system and is an input to the
MPC755 informing it that it can go into the quiescent state. Under normal operation this occurs during a low-power
mode selection. In order for COP to work, the MPC755 must see this signal asserted (pulled down). While shown
on the COP header, not all emulator products drive this signal. If the product does not, a pull-down resistor can be
populated to assert this signal. Additionally, some emulator products implement open-drain type outputs and can
only drive QACK asserted; for these tools, a pull-up resistor can be implemented to ensure this signal is deasserted
when it is not being driven by the tool. Note that the pull-up and pull-down resistors on the QACK signal are
mutually exclusive and it is never necessary to populate both in a system. To preserve correct power-down operation,
QACK should be merged via logic so that it also can be driven by the PCI bridge.
8.8
Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat
sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat sinks may be attached to
the package by several methods—adhesive, spring clip to holes in the printed-circuit board or package, and
mounting clip and screw assembly; see
Figure 25
. This spring force should not exceed 5.5 pounds of force.
Figure 25
describes the package exploded cross-sectional view with several heat sink options.
Figure 25. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the MPC755. There are several
commercially-available heat sinks for the MPC755 provided by the following vendors:
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
603-224-9988
Adhesive or
Thermal Interface Material
Heat Sink
CBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
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| MPC755BPX300LE | RISC Microprocessor Hardware Specifications |
| MPC8240EC | Integrated Processor Hardware Specifications |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC755CRX400TE | 功能描述:微處理器 - MPU GF RV2.84A-40C 360CBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755CVT350LE | 功能描述:微處理器 - MPU GF RV2.8,4A,105C,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755CVT400LE | 功能描述:微處理器 - MPU GF RV2.84A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC76 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Metal Plate Cement Resistors |
| MPC76-0.05HK | 制造商:FUKUSHIMA 功能描述: |
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