- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄371134 > MPC755CRX400LE (Motorola, Inc.) RISC Microprocessor Hardware Specifications PDF資料下載
參數(shù)資料
| 型號： | MPC755CRX400LE |
| 廠商： | Motorola, Inc. |
| 英文描述： | RISC Microprocessor Hardware Specifications |
| 中文描述： | RISC微處理器硬件規(guī)格 |
| 文件頁數(shù)： | 46/56頁 |
| 文件大?。?/td> | 1652K |
| 代理商： | MPC755CRX400LE |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁當(dāng)前第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁
MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
46
Freescale Semiconductor
System Design Information
Figure 26. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
8.8.2
Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the thermal
contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 27
shows
the thermal performance of three thin-sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare
joint, and a joint with thermal grease as a function of contact pressure. As shown, the performance of these thermal
interface materials improves with increasing contact pressure. The use of thermal grease significantly reduces the
interface thermal resistance. That is, the bare joint results in a thermal resistance approximately seven times greater
than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 25
).
This spring force should not exceed 5.5 pounds of force. Therefore, the synthetic grease offers the best thermal
performance, considering the low interface pressure. Of course, the selection of any thermal interface material
depends on many factors—thermal performance requirements, manufacturability, service temperature, dielectric
properties, cost, etc.
External Resistance
(Note the internal versus external package resistance.)
External Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Die/Package
Die Junction
Internal Resistance
Package/Leads
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC755 | RISC Microprocessor Hardware Specifications |
| MPC755BRX300LE | RISC Microprocessor Hardware Specifications |
| MPC755BPX300LE | RISC Microprocessor Hardware Specifications |
| MPC8240EC | Integrated Processor Hardware Specifications |
| MPC8240 | 32-Bit Microprocessor(32位微處理器) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC755CRX400TE | 功能描述:微處理器 - MPU GF RV2.84A-40C 360CBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755CVT350LE | 功能描述:微處理器 - MPU GF RV2.8,4A,105C,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755CVT400LE | 功能描述:微處理器 - MPU GF RV2.84A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC76 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Metal Plate Cement Resistors |
| MPC76-0.05HK | 制造商:FUKUSHIMA 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。