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| 型號： | MPC8377E-RDBA |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 19/127頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD REF DES MPC8377 REV 2.1 |
| 設(shè)計(jì)資源： | MPC8379E-RDB Ref Design Guide |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 類型： | MPU |
| 適用于相關(guān)產(chǎn)品： | MPC8377E |
| 所含物品： | 板，CD |
| 相關(guān)產(chǎn)品： | MPC8378EVRANG-ND - MPU PWRQUICC II 800MHZ 689TEPBGA MPC8378EVRALG-ND - MPU PWRQUICC II 667MHZ 689TEPBGA MPC8378EVRAJF-ND - MPU PWRQUICC II 533MHZ 689TEPBGA MPC8378EVRAGD-ND - MPU PWRQUICC II 400MHZ 689TEPBGA MPC8379EVRANG-ND - MPU PWRQUICC II 800MHZ 689TEPBGA MPC8379EVRALG-ND - MPU PWRQUICC II 667MHZ 689TEPBGA MPC8379EVRAJF-ND - MPU PWRQUICC II 533MHZ 689TEPBGA MPC8379EVRAGD-ND - MPU PWRQUICC II 400MHZ 689TEPBGA MPC8377EVRALG-ND - MPU PWRQUICC II 667MHZ 689TEPBGA MPC8377EVRAJF-ND - MPU PWRQUICC II 533MHZ 689TEPBGA 更多... |
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MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
115
24.2
Thermal Management Information
For the following sections, PD = (VDD × IDD) + PI/O where PI/O is the power dissipation of the I/O drivers.
24.2.1
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TJ = junction temperature (°C)
TA = ambient temperature for the package (°C)
RθJA = junction to ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The junction to ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Generally, the value obtained on a single layer board is appropriate for
a tightly packed printed circuit board. The value obtained on the board with the internal planes is usually
appropriate if the board has low power dissipation and the components are well separated. Test cases have
demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible.
24.2.2
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
NOTE
The heat sink cannot be mounted on the package.
Junction-to-package natural convection on top
ψJT
6
°C/W
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
Table 81. Package Thermal Characteristics for TePBGA II (continued)
Parameter
Symbol
Value
Unit
Note
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8377E-RDBA | 制造商:Freescale Semiconductor 功能描述:MPC837x Family Reference Desig |
| MPC8377EVRAFDA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377EVRAFFA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377EVRAFGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377EVRAGD | 功能描述:微處理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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