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| 型號(hào)： | MPC8377E-RDBA |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 21/127頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD REF DES MPC8377 REV 2.1 |
| 設(shè)計(jì)資源： | MPC8379E-RDB Ref Design Guide |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 類型： | MPU |
| 適用于相關(guān)產(chǎn)品： | MPC8377E |
| 所含物品： | 板，CD |
| 相關(guān)產(chǎn)品： | MPC8378EVRANG-ND - MPU PWRQUICC II 800MHZ 689TEPBGA MPC8378EVRALG-ND - MPU PWRQUICC II 667MHZ 689TEPBGA MPC8378EVRAJF-ND - MPU PWRQUICC II 533MHZ 689TEPBGA MPC8378EVRAGD-ND - MPU PWRQUICC II 400MHZ 689TEPBGA MPC8379EVRANG-ND - MPU PWRQUICC II 800MHZ 689TEPBGA MPC8379EVRALG-ND - MPU PWRQUICC II 667MHZ 689TEPBGA MPC8379EVRAJF-ND - MPU PWRQUICC II 533MHZ 689TEPBGA MPC8379EVRAGD-ND - MPU PWRQUICC II 400MHZ 689TEPBGA MPC8377EVRALG-ND - MPU PWRQUICC II 667MHZ 689TEPBGA MPC8377EVRAJF-ND - MPU PWRQUICC II 533MHZ 689TEPBGA 更多... |
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MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
117
The thermal resistance is expressed as the sum of a junction to case thermal resistance and a
case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction to ambient thermal resistance (°C/W)
RθJC = junction to case thermal resistance (°C/W)
RθCA = case to ambient thermal resistance (°C/W)
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
This first-cut approach overestimates the heat sink size required, since heat flow through the board is not
accounted for, which can be as much as one-third to one-half of the power generated in the package.
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling through the package and board and
the convection cooling due to the air moving through the application. Simplified thermal models of the
packages can be assembled using the junction-to-case and junction-to-board thermal resistances listed in
the thermal resistance table. More detailed thermal models can be made available on request.
The thermal performance of devices with heat sinks has been simulated with a few commercially available
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,
adjacent component power dissipation) and the physical space available. Because of the wide variety of
application environments, a single standard heat sink applicable to all cannot be specified.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8377E-RDBA | 制造商:Freescale Semiconductor 功能描述:MPC837x Family Reference Desig |
| MPC8377EVRAFDA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377EVRAFFA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377EVRAFGA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377EVRAGD | 功能描述:微處理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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