參數(shù)資料
型號(hào): MPC8377EWLANB
廠商: Freescale Semiconductor
文件頁數(shù): 116/127頁
文件大小: 0K
描述: ACCESS POINT/ROUTER MPC8377
標(biāo)準(zhǔn)包裝: 1
MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
89
This figure shows the mechanical dimensions and bottom surface nomenclature of the TEPBGA II
package.
Figure 63. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II
Note:
1 All dimensions are in millimeters.
2 Dimensioning and tolerancing per ASME Y14. 5M-1994.
3 Maximum solder ball diameter measured parallel to Datum A.
4 Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
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