參數(shù)資料
型號(hào): MPC8377EWLANB
廠商: Freescale Semiconductor
文件頁數(shù): 18/127頁
文件大小: 0K
描述: ACCESS POINT/ROUTER MPC8377
標(biāo)準(zhǔn)包裝: 1
MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
114
Freescale Semiconductor
24 Thermal
This section describes the thermal specifications of this chip.
24.1
Thermal Characteristics
This table provides the package thermal characteristics for the 689 31
× 31mm TePBGA II package.
48.0
0
1
2
3
576
144
288
72 6
36
18
360
432
66.7
0
1
2
533
133
266
66.7
33.3
16.7
333
400
25.0
0
4
8
800
200
100 6
50
25
400
500
600
33.3
0
2
8
533
266.7
267
133 6
66.7
33.3
400
533
667
800
50.0
0
4
800
200
100 6
50
25
400
500
600
50.0
0
2
8
800
400
400 5
100 6
50
600
800
66.7
0
2
4
533
266.7
267
133 6
66.7
33.3
400
533
667
800
66.7
0
2
5
667
333
83.3 6 41.6
333
500
667
66.7
0
2
6
800
400
400 5
100 6
50
400
600
800
Notes:
1. Values in MHz.
2. System PLL VCO range: 400–800 MHz.
3. CSB frequencies less than 133 MHz will not support Gigabit Ethernet rates.
4. Minimum data rate for DDR2 is 250 MHz and for DDR1 is 167 MHz.
5. Applies to DDR2 only.
6. Applies to eLBC PLL-enabled mode only.
Table 81. Package Thermal Characteristics for TePBGA II
Parameter
Symbol
Value
Unit
Note
Junction-to-ambient natural convection on single layer board (1s)
RθJA
21
°C/W
1, 2
Junction-to-ambient natural convection on four layer board (2s2p)
RθJA
15
°C/W
Junction-to-ambient (at 200 ft/min) on single layer board (1s)
RθJMA
16
°C/W
1, 3
Junction-to-ambient (at 200 ft/min) on four layer board (2s2p)
RθJMA
12
°C/W
1, 3
Junction-to-board thermal
RθJB
8
°C/W
Junction-to-case thermal
RθJC
6
°C/W
Table 80. Example Clock Frequency Combinations (continued)
eLBC 1
e300 Core 1
Ref
1
LBCM DDRCM SVCOD SPMF
Sys
VCO
1,2 CSB
1,3 DDR data
rate
1,4
/2
/4
/8
× 1 × 1.5 × 2 × 2.5 × 3
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