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| 型號： | REPORT |
| 英文描述： | Report - Lead (Pb)-Free Packaging Strategy 2000-2003 |
| 中文描述： | 報告-無鉛（Pb）2000-2003免費(fèi)包裝策略 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大小： | 188K |
| 代理商： | REPORT |
Reliability Effects
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10
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Changing the material used for the solder joint also changes the thermo-mechanical behavior of the joint. The
mechanical properties of the solder alloy contribute significantly to the strength of the joint. Many of the non-Pb
materials seem to be stronger or more ductile than Sn/37Pb, and the microstructure of these materials also
appears to be immune to the grain-coarsening process that Sn/37Pb exhibits. Increased strength and ductility
should result in stronger, more fatigue-resistant solder joints, and the absence of grain coarsening should result in
solder joints with greater stability. But the increase in solder joint strength may also result in higher levels of strain
at the interfaces between the solder joint and the package lead or substrate attachment pad. Thus, the quality of
this interface becomes more critical to board-level reliability. The level of residual stress generated at the
temperature at which the solder joint solidifies also affects the reliability of the solder joint. The full range of
mechanical properties with respect to temperature for most of the alternate solders has not been well
characterized; adequately modeling the solder joints using FEA techniques is not possible without this material
characterization. Therefore, the solder joint reliability must be determined experimentally.
Implementation Costs
The cost of converting to Pb-free manufacturing comes from the implementation of new processes, development of
new materials, and qualification of the resulting products. The implementation of the new processes has an
expense associated with both the new process itself (equipment, materials, facilities, etc.) and running the new
process in parallel with older processes during any transition period. The duration of the transition period is difficult
to determine until clear plans for conversion on the part of customers are defined. However, it is safe to assume
that the conversion of customers will not be well synchronized. The component supplier will have to maintain the
parallel process lines for an indefinite period, or demonstrate that the new lead finishes are sufficiently compatible
with conventional Sn/37Pb solder processes. And, in the absence of explicit regulation, some OEMs may never
convert to Pb-free assembly for part or all of their product lines. In that case, separate component process lines will
be permanent installations. Such parallel process lines increase the cost both of conversion and of continued
component production.
The cost of qualifying products is potentially much more than establishing the necessary new processes. As a
minimum, families of packages will need to be requalified for moisture sensitivity under a revised version of the
standard test method for preconditioning. (A proposal for modifying the existing JEDEC preconditioning standard is
about to be submitted to the JC-14 committee.) If new materials or assembly processes are needed to make the
packaged component more resistant to temperature, then complete product qualification will also be needed. For
component suppliers with extensive catalogs, the cost and time required to do such qualifications may exceed any
other cost incurred.
Implementation Plan
In responding to requirements for components compatible with Pb-free assembly, two extreme positions are
possible. The first is to do nothing, wait to see what happens, and address the problem at the time customers
demand Pb-free components. The second is to rush into a program to change lead finishes and put Pb-free
components on the market as quickly as possible. Either approach is a defensible option that comes with
associated problems. The danger in the first approach is that the company would not be able to respond in time to
customer requirements and would potentially lose business. The danger in the second approach is that the
company would ignore the reliability and manufacturing issues outlined above, commit excessive resources to the
program, and convert our manufacturing processes ahead of the time that business would naturally support. The
newly installed manufacturing capacity may stand idle for an indefinite time.
AMD must find a reasonable middleground between these extremes that allows us to fully understand the problems
and the solutions, and to map whatever manufacturing conversion is needed against the business plan. It is
ultimately to our advantage that the development process be undertaken methodically and efficiently, and that any
conversion process be an orderly addition to current manufacturing capabilities. Additionally, our development
and/or conversion must be coordinated with our family of subcontractors. All of this implies that we begin our
development process as early as possible.
Because of the package-related issues described earlier, AMD cannot make a commitment to produce Pb-free
components without having completed certain initial evaluation projects. The evaluation projects require
cooperation between Sunnyvale and the offshore sites in Singapore, Penang, Bangkok and Suzhou. The strategic
program should consist of three phases of which the first will be an evaluation of existing packages and potential
replacement materials.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| RES-NETWORK | Interface IC |
| RES060L03 | TRANSISTOR | MOSFET | MATCHED PAIR | N-CHANNEL | 30V V(BR)DSS | 6A I(D) | SO |
| RES070N03 | TRANSISTOR | MOSFET | N-CHANNEL | 30V V(BR)DSS | 7A I(D) | SO |
| RES100N03 | TRANSISTOR | MOSFET | N-CHANNEL | 30V V(BR)DSS | 10A I(D) | SO |
| RES5-F03 | FILTER CHASSIS OHNE IEC EINGANG 3A |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| REPORTER 8.5 PROFESSIONAL | 制造商:Flir Systems 功能描述: |
| REPOT01-10 | 制造商:RECOM Power Inc 功能描述: 制造商:RECOM Power Inc 功能描述:10A POTENTIOMETER |
| RE-PRO/09 | 制造商:BM POLYCO 功能描述:ELECTRICIANS LEATHER PROTECTOR 09 |
| RE-PRO/10 | 制造商:BM POLYCO 功能描述:ELECTRICIANS LEATHER PROTECTOR 10 |
| REPV0011A-M | 制造商:Panasonic Industrial Company 功能描述:PC BOARD |
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