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| 型號(hào)： | REPORT |
| 英文描述： | Report - Lead (Pb)-Free Packaging Strategy 2000-2003 |
| 中文描述： | 報(bào)告-無(wú)鉛（Pb）2000-2003免費(fèi)包裝策略 |
| 文件頁(yè)數(shù)： | 15/16頁(yè) |
| 文件大小： | 188K |
| 代理商： | REPORT |
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1A Evaluate the sensitivity of current package materials and assembly methods to the elevated
temperatures necessary for the new reflow profiles.
This program would begin by selecting a representative
group of production packages, including leaded and BGA types, and subjecting these packages to our standard
qualification tests with the higher temperature reflow profiles used for the pre-conditioning steps. The packages
would be examined in detail during the tests in order to determine the onset of additional defects beyond those
expected from the standard qualification procedures. (Our standard qualification procedure would be the control
for this evaluation.) The results of the evaluation will determine the extent of our jeopardy with regard to higher
processing temperatures, and be the basis for subsequent evaluation of new materials and assembly methods.
This evaluation should also be the basis for evaluation of board-level reliability for new lead finishes and solder
alloys.
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11
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1B
Evaluate the impact of higher package and board assembly temperatures on device performance.
We
need to determine the effect of exposure to higher processing temperatures on device performance. Issues
such as Flash memory data retention above 250oC and mechanical stability of new fab processes using organic
dielectrics must be included in the evaluation.
1C Evaluate lead finish options for leaded packages.
We must evaluate metallurgical, process, and cost
parameters of alternative plated finishes in order to determine the optimum replacement process.
1D Evaluate solder ball options for BGA and FBGA packages
. We must evaluate metallurgical, process, and
cost parameters of alternative solder ball alloys. We will need to consider possible changes in the solder pad
finish on the BGA substrate as well. This part of the evaluation includes an investigation of solder joint reliability.
The second part of the program will extend the work of phase 1 to a development phase in two parts:
2A Pb-free process compatible packages.
A selection of package types will be modified though changes in
materials or construction as recommended by the work in phase 1 in order to achieve the required moisture
sensitivity level with a 260
°
C preconditioning profile. The modified packages will undergo a complete
qualification process to demonstrate achievement of this requirement. No change will be made to lead finish or
solder ball composition.
2B
Fully Pb-free packages.
A selection of package types will be modified though changes in materials or
construction including lead finish and solder ball composition as recommended by the work in phase 1. The
modified packages will undergo a complete qualification process to demonstrate the required moisture
sensitivity level with a 260
°
C preconditioning profile. Board-level testing will be performed to demonstrate the
reliability of the new lead finish and solder ball composition.
Phase 3 of the program will be production implementation of the solutions developed in phase 2. The timing and
target devices for this phase will depend strongly on market forecasts and business plans formulated by the effected
product lines. Consultation between manufacturing and these product lines will be required to do the capacity
planning and any necessary equipment conversion in the assembly sites.
During the course of this strategic program certain additional activities will take place:
1
Establish a program manager for all Pb-free activities.
Since these activities cross over boundaries with
customers and with internal organizations, the establishment of a directing body, whether a specific individual or
a group, is needed to oversee the activity within MSG and coordinate with outside groups.
2
Select a set of specific customers with whom we wish to engage in cooperative development activity.
Such development will include reliability and compatibility evaluations. Candidates such as Nortel Networks,
Delco-Delphi, Siemens, and Compaq Computer would be appropriate.
3
Select specific industry consortial organizations with which we will engage in development activity.
This
action serves to lend our weight to encourage the worldwide industry to converge on a single solder replace-
ment, or at least a very limited number of such alloys. The most important candidates are the High Density
Packaging Users Group (HDPUG), the International Tin Research Institute (ITRI), and the Japan Electronic
Industry Development Association (JEIDA) or EIAJ.
4
Encourage our subcontractors to participate in the above activities or incorporate them as partners
explicitly.
We cannot depend on our subcontractors to develop conversion plans consonant with our needs
independently. We must help them choose materials and processes, and validate those choices.
5
Work with AMD’s product groups to perform an official survey of customers to determine both the need
and the requirements for specific AMD products in Pb-free form.
The product groups will need to develop
business plans based on this information as justification for MSG to formulate subsequent conversion plans.
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| REPORTER 8.5 PROFESSIONAL | 制造商:Flir Systems 功能描述: |
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