參數(shù)資料
型號: REPORT
英文描述: Report - Lead (Pb)-Free Packaging Strategy 2000-2003
中文描述: 報告-無鉛(Pb)2000-2003免費包裝策略
文件頁數(shù): 16/16頁
文件大?。?/td> 188K
代理商: REPORT
6
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12
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Develop an in-house expertise in the metallurgy of solders.
Understanding the applicability of any particular
lead finish or solder ball attach process requires an understanding of the metallurgy of interfaces at the package
(for BGAs/FBGAs) and at the board.
7
Establish a website for information on our Pb-free program.
Completion of phases 1 and 2 outlined above requires in itself a significant commitment of resources by MSG and
other divisions of the company. The goal for the first phase evaluation should be to define by Q4, 2001, the extent of
any problems with existing package materials and construction and propose solutions to these problems that will be
the basis for the phase 2 projects. This goal should be accomplished by Q4, 2001.
The phase 2 projects, as well as implementation as manufacturing processes in phase 3, will be a longer-term
program extending into 2002.
Acknowledgments
Thanks are hereby given to Donna Sadowy and Fumio Namba of AMD, and to Brian Swiggett and Neil Moskowitz
of Prismark, for their assistance in gathering the information necessary for this document. Thanks are also due to
many of my AMD colleagues for assistance during visits to customers throughout the world. In addition, thanks are
due to John Hunter who encouraged this study.
相關(guān)PDF資料
PDF描述
RES-NETWORK Interface IC
RES060L03 TRANSISTOR | MOSFET | MATCHED PAIR | N-CHANNEL | 30V V(BR)DSS | 6A I(D) | SO
RES070N03 TRANSISTOR | MOSFET | N-CHANNEL | 30V V(BR)DSS | 7A I(D) | SO
RES100N03 TRANSISTOR | MOSFET | N-CHANNEL | 30V V(BR)DSS | 10A I(D) | SO
RES5-F03 FILTER CHASSIS OHNE IEC EINGANG 3A
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