參數(shù)資料
型號(hào): REPORT
英文描述: Report - Lead (Pb)-Free Packaging Strategy 2000-2003
中文描述: 報(bào)告-無(wú)鉛(Pb)2000-2003免費(fèi)包裝策略
文件頁(yè)數(shù): 8/16頁(yè)
文件大?。?/td> 188K
代理商: REPORT
pounds, the proposed change would require reporting of releases and off-site transfer of greater than 10 pounds of
Pb compounds.
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4
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Panasonic MJ-30 Mini-disk Player
Rationale for Pb Bans
The basis for the above legislative activity is to curtail the disposal of hazardous materials in landfills. This is a
particular problem in Europe and Japan, since the availability of areas for landfill is extremely limited. The argument
in the case of Pb is that elemental or compounded Pb can be leached by percolation into lower level ground water
sources, and then be consumed by humans from drinking water or by uptake by edible plants. Although there has
been considerable study of the mechanisms for the leaching of Pb, the science is far from definitive on the subject.
Leaching processes have been identified, but there is uncertainty if these processes occur naturally. Regulatory
agencies generally wish to err on the side of conservatism where even a remote possibility of hazard is involved.
Market Incentives for Eliminating Pb in Electronics
Aside from the pressure of legislative activity, many electronic manufacturers are viewing the elimination of Pb from
their products as an advantage to product marketing. With concern for environmental damage due to industrial
activity continuing to rise in the general world population, labeling of products as being more “green” is on the rise
as well. However, under a legislative regulation “Pb-free” would be explicitly defined, whereas for market-driven
action “Pb-free” is a much more elastic term. Although a degree of mythology has arisen around the issue in regard
to activity such as that in Japan, market forces may have more long-term impact than any legislative action.
Japan
In fact, some Japanese electronic companies are now marketing Pb-free products or have announced plans to do
so. These product and plan announcements have generally been presented in the trade press in oversimplified form,
but it is clear that these companies are at least making a commitment to the appearance of being truly Pb-free.
The most frequently cited example of an actual product is a mini-disk
player produced by Panasonic. Although the product is not completely Pb-
free, it was assembled using a Sn/Ag/Bi solder alloy, and many of the
components had Pb-free lead finishes (no BGAs were used). This product
has reportedly allowed Panasonic to gain some market share for this
product line, although hard data confirming this claim is not readily
available. Other Pb-free products reportably available in Japan include a
Panasonic television, a Toshiba laptop computer, and other consumer
products.
A number of Japanese companies, including Hitachi, NEC, Toshiba,
Matsushita, and Sony, had announced plans for conversion to Pb-free
assembly during 2000
2001. Although few of these plans have been accomplished as originally announced, the
fact of their publication indicates the intent of the issuing companies. The method announced by Sony for this
conversion is instructive in that Sony is taking account of the fact that it will be very difficult to convert to Pb-free all
at once. Sony has developed their own Sn/Ag/Bi/Cu/germanium alloy that they intend to use initially in one model in
each of their sales categories. However, they will be satisfied if one component type in each of those models is
completley Pb-free. In 2000, they will use the Pb-free solder for a minimum of one component type in all domestic
products (i.e., those sold in Japan). In 2001, they will use the Pb-free solder for a minimum of one component type
in all products sold worldwide. In briefings given to their suppliers, Sony recognized that the major obstacle to
moving beyond these immediate goals would be the ability of components from all their suppliers to withstand the
higher processing temperatures needed for their chosen solder process.
At least one Japanese semiconductor manufacturer, Matsushita Electronics Corp, announced a program to supply
Pb-free integrated circuits (ICs). The announced program was originally restricted to leaded packages, and
palladium and Sn/Bi alloy plating are specified as lead finishes. All “new packages to be produced from April 1999”
will conform to Pb-free specifications. Other products will be converted as needed with “approval,” but conversion
will be completed by the end of fiscal 2000 (i.e., calendar 2001). However, resistance to higher reflow temperatures
will be treated “separately with each package.” The date for complete conversion has since been adjusted to fiscal
2002.
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