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| 型號： | REPORT |
| 英文描述： | Report - Lead (Pb)-Free Packaging Strategy 2000-2003 |
| 中文描述： | 報告-無鉛（Pb）2000-2003免費包裝策略 |
| 文件頁數(shù)： | 9/16頁 |
| 文件大?。?/td> | 188K |
| 代理商： | REPORT |
Europe
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5
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Nortel Meridian Phone Board
There have been few actual product announcements outside of Japan.
But one such product was the Nortel Meridian desk telephone. This
phone was assembled using a Sn/Cu solder paste screened on an
organic solder preservative (OSP)-Cu printed circuit board (PCB). The
lead finish on the components was either tin or palladium. This product
was not intended to be a high-reliability telephone, but it apparently
functioned well in the home/office environment for which it was
designed.
In private communications most of AMD’s major customers in Europe
(Siemens, Nortel, Ericsson,
etal
.) have indicated that they have
internal programs for the development of Pb-free solder processes.
The extent and status of these programs is not completely clear, but
these companies are clearly driven by both the WEEE/ROHS directive
proposals (that they expect to gain final approval at some point) and the threat of Pb-free products imported from
Japan. There have been few, if any, public announcements regarding plans from European companies, although
general knowledge of their intentions is widely assumed. Product introductions in 2002 are very likely.
Requirements are beginning to be defined in general component specifications. A notable development is the
acceptance by one major European OEM of “Pb-free process compatible” components that are not themselves Pb-
free; that is, components that can withstand the elevated process temperatures of Pb-free assembly processes.
United States
Pb-free development in the US has been sponsored primarily by automotive electronics suppliers such as Ford
Visteon and Delphi-Delco Electronics. The interest from the automotive electronics sector, in both the US and
Europe
(e.g.,
Siemens and Bosch), is driven to a large extent by a desire to raise the operating temperature of their
products. Since a weak link in the reliability chain for higher temperature operation is the eutectic Sn/Pb solder joint,
converting to a higher temperature solder material is desirable. That such materials are basically Pb-free and,
hence, environmentally friendly is a side benefit. But validation of reliability and transfer of designs into production
in the automotive business is a time consuming process, and it is not likely that changes will come rapidly.
However, the automotive electronic suppliers will likely spur development activities by their suppliers in order to be
ready to make the conversion to Pb-free assembly when they need it.
Other US manufacturers, such as Motorola and Lucent, have made public expressions of support for
environmentally friendly manufacturing. And Lucent has used Pb-free solder processes in a few submodules, such
as power convertors.
Industry-Wide Activity
In addition to individual development activity, many suppliers and OEMs are working with various trade organiza-
tions in all three geographic areas (US, Europe, and Japan) on Pb-free roadmaps and processes. In the US, the
IPC and National Electronic Manufactures Initiative (NEMI) have attempted to take a leadership role by organizing
conferences and initiating consortial development projects. NEMI is including implementation of Pb-free assembly
for US manufacturers in its biannual technology roadmap. The High Density Packaging Users Group (HDPUG) has
initiated a consortial project with European and US manufacturers. NEMI and HDPUG are coordinating their
respective projects to avoid unnecessary duplication of effort. In Europe, the International Tin Research Institute
(ITRI), based in England, has set up a Pb-free soldering research consortium under the name SOLDERTEC that
has 45 member companies and wishes to be the premier such consortium in Europe. The European national
governments and the EU itself have funded other research activities. The Japan Electric Industry Development
Association (JEIDA) and the Japan Institute for Interconnecting and Packaging Electronic Circuits (JIEP) have been
developing roadmaps for Pb-free manufacturing by Japanese companies. The New Energy and Industrial
Technology Development Organization (NEDO) was established in 1998 to coordinate the activities of JEIDA, the
Japan Welding Society (JWS), and the Electronic Industries Association of Japan (EIAJ); NEDO had a budget of
￥350 million for two years of operation. In 2001 JEIDA and EIAJ merged their respective organizations into the
Japan Electric Industry Technology Association (JEITA) in order to enhance their presence as a representative of
Japanese industry.
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