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| 型號(hào)： | REPORT |
| 英文描述： | Report - Lead (Pb)-Free Packaging Strategy 2000-2003 |
| 中文描述： | 報(bào)告-無鉛（Pb）2000-2003免費(fèi)包裝策略 |
| 文件頁數(shù)： | 5/16頁 |
| 文件大?。?/td> | 188K |
| 代理商： | REPORT |
Lead (Pb)-Free Packaging Strategy 2000
2003
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1
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Executive Summary
The use of lead (Pb) in electronic products is a concern to some environmental groups. Imposition of a ban on this
use has been threatened in the past, but such a ban has never been implemented due to serious technical
concerns. While it is not clear when, or even if, outright bans on the use of Pb may come into effect, a number of
large electronic manufacturers believe that a
de facto
ban may occur in some markets in the near future. Many of
these manufacturers are our customers, so we must understand the issues and problems of eliminating Pb from
our products, and we must develop plans to address potential customer requirement that we do so.
The use of Pb has been banned from plumbing, paint, and other common applications for many years in the USA
and Europe. The most significant new regulatory activity is proposed directives on Waste in Electrical and
Electronic Equipment (WEEE) and Reduction of Hazardous Substrates (ROHS) now before the Parliament of the
European Union (EU). The draft ROHS directive states that: “Member States shall ensure that the use of Pb,
mercury, cadmium, hexavalent chromium, PBBs and PBDEs is substituted by 1 January 2006.” The proposed
directive has elicited strong opposition from industry organizations. A few other countries have enacted, or are
proposing to enact, legislation regarding disposal of electronic equipment, but none of these proposals explicitly
bans the use of any materials. There is at present no legislation anywhere that explicitly bans the use of Pb.
Many electronic manufacturers view the elimination of Pb from their products as an advantage to product
marketing. However, under a legislative regulation “Pb-free” would be explicitly defined, for market-driven action
“Pb-free” is a much more elastic term. A number of “Pb-free” products have been introduced by, for example,
Panasonic, Toshiba, and Nortel. Other companies, including Hitachi, NEC, Matsushita, and Sony, had announced
plans for conversion to Pb-free assembly during 2000
2001. Many of our customers in the telecommunications and
automotive sectors have programs for development of Pb-free processes and are querying their suppliers regarding
availability of Pb-free compatible components.
The issues for components suppliers such as AMD can be summarized as follows:
There is no exact replacement alloy for eutectic tin/lead (Sn/Pb) solder.
The most likely replacement alloys have melting or liquidus temperatures that are 30
40°C higher than eutectic
Sn/Pb (183°C).
There is no single best choice of replacement alloy. Industry is slowly converging on a tin/silver/copper
(Sn/Ag/Cu) alloy. Usage of this material may be limited by patent restrictions.
Board assembly reflow temperature profiles will increase to
260°C to accommodate the replacement alloys.
A change in package contact metallurgy (
e. g.
BGA solder balls) will not necessarily be compatible with
conventional Sn/Pb reflow processes.
Existing moisture-sensitivity data is invalid with respect to the new reflow profiles.
Existing board-level reliability data is invalid with respect to new solders alloys and reflow profiles.
Compatibility of existing package construction and materials to higher temperature reflow is not well
understood.
The effect on device structures of internal package stresses caused by a higher temperature reflow is not well
understood.
Changes in package materials to accommodate a higher temperature reflow will require new package
qualifications.
A three-part strategy to address the above issues is proposed. During Part 1 we will evaluate the limits with respect
to higher reflow temperatures of existing package materials and construction; we will also evaluate available
options for lead finishes and BGA solder balls. During Part 2 we will complete development of new materials where
necessary and the processes for new lead finishes and solder ball metallurgy, and demonstrate a capability for
qualification of Pb-free packaged devices. Part 3 will comprise production implementation. Completion of Part 3 will
be in conjunction forecasts of the actual need for shippable product.
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