參數(shù)資料
型號: SI3230PPQX-EVB
廠商: Silicon Laboratories Inc
文件頁數(shù): 43/108頁
文件大小: 0K
描述: BOARD EVAL W/DISCRETE INTERFACE
標(biāo)準(zhǔn)包裝: 1
系列: ProSLIC®
主要目的: 接口,模擬前端(AFE)
已用 IC / 零件: Si3230
已供物品: 板,CD
Si3230
4
Preliminary Rev. 0.96
Not
Recommended
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1. Electrical Specifications
Table 1. Absolute Maximum Ratings and Thermal Information
1
Parameter
Symbol
Value
Unit
Si3230
DC Supply Voltage
VDDD, VDDA1, VDDA2
–0.5 to 6.0
V
Input Current, Digital Input Pins
IIN
±10
mA
Digital Input Voltage
VIND
–0.3 to (VDDD +0.3)
V
ESD, Human Body Model
2000
V
Operating Temperature Range2
TA
–40 to 100
C
Storage Temperature Range
TSTG
–40 to 150
C
TSSOP-38 Thermal Resistance, Typical
JA
70
C/W
QFN-38 Thermal Resistance, Typical
JA
35
C/W
Continuous Power Dissipation2
PD
0.7
W
Si3201
DC Supply Voltage
VDD
–0.5 to 6.0
V
Battery Supply Voltage
VBAT
–104
V
Input Voltage: TIP, RING, SRINGE, STIPE pins
VINHV
(VBAT – 0.3) to (VDD +0.3)
V
Input Voltage: ITIPP, ITIPN, IRINGP, IRINGN pins
VIN
–0.3 to (VDD +0.3)
V
Operating Temperature Range2
TA
–40 to 100
C
Storage Temperature Range
TSTG
–40 to 150
C
SOIC-16 Thermal Resistance, Typical3
JA
55
C/W
Continuous Power Dissipation2
PD
1.0
W
Notes:
1. Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation
should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Operation above 125 oC junction temperature may degrade device reliability.
3. Thermal resistance assumes a multi-layer PCB with the exposed pad soldered to a topside PCB pad.
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