參數(shù)資料
型號(hào): THS8083-95CPZP
廠商: TEXAS INSTRUMENTS INC
元件分類: 消費(fèi)家電
英文描述: SPECIALTY CONSUMER CIRCUIT, PQFP100
封裝: POWER, THERMALLY ENHANCED, PLASTIC, TQFP-100
文件頁(yè)數(shù): 53/61頁(yè)
文件大?。?/td> 239K
代理商: THS8083-95CPZP
7–1
7 Mechanical Data
PZP (S-PQFP-G100)
PowerPAD
PLASTIC QUAD FLATPACK
0,13 NOM
50
26
Thermal Pad
(see Note D)
0,75
0,45
0,25
Seating Plane
4146929/A 04/99
Gage Plane
0,27
75
0,17
76
100
SQ
1
15,80
16,20
14,20
13,80
12,00 TYP
1,05
0,95
1,20 MAX
51
25
0,50
M
0,08
0
°–7°
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
PowerPAD is a trademark of Texas Instruments.
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