參數(shù)資料
型號: W25Q16CLSSIG
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 16M X 1 SPI BUS SERIAL EEPROM, PDSO8
封裝: 0.208 INCH, GREEN, PLASTIC, SOIC-8
文件頁數(shù): 73/77頁
文件大?。?/td> 2458K
代理商: W25Q16CLSSIG
W25Q16CL
Publication Release Date: July 08, 2010
- 75 -
Preliminary - Revision A
14. ORDERING INFORMATION
W(1) 25Q 16C L xx(2)
W = Winbond
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
16C = 16M-bit
L = 2.3V to 3.6V
SN = 8-pin SOIC 150-mil
ZP = 8-pad WSON 6x5mm
SF = 16-pin SOIC 300-mil
SS = 8-pin SOIC 208-mil
DA = 8-pin PDIP 300-mil
I = Industrial (-40°C to +85°C)
(3,4)
G =
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
P
=
Green Package with Status Register Power-Down & OTP enabled
Notes:
1. The “W” prefix is not included on the part marking.
2. Only the 2
nd letter is used for the part marking; WSON package type ZP is not used for the part marking.
3. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and
Reel (shape T) or Tray (shape S), when placing orders.
4. For shipments with OTP feature enabled, please specify when placing orders.
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