參數(shù)資料
型號(hào)： W25Q16CLSSIG
廠商： WINBOND ELECTRONICS CORP
元件分類： PROM
英文描述： 16M X 1 SPI BUS SERIAL EEPROM, PDSO8
封裝： 0.208 INCH, GREEN, PLASTIC, SOIC-8
文件頁數(shù)： 75/77頁
文件大?。?/td> 2458K
代理商： W25Q16CLSSIG
W25Q16CL
Publication Release Date: July 08, 2010
- 77 -
Preliminary - Revision A
15. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
07/08/10
New Create Preliminary
Preliminary Designation
The “Preliminary” designation on a Winbond datasheet indicates that the product is not fully
characterized. The specifications are subject to change and are not guaranteed. Winbond or an
authorized sales representative should be consulted for current information before using this product.
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
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參數(shù)描述
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