參數(shù)資料
型號: XC2S100-5FG256I
廠商: Xilinx Inc
文件頁數(shù): 69/99頁
文件大?。?/td> 0K
描述: IC FPGA 2.5V I-TEMP 256-FBGA
標(biāo)準(zhǔn)包裝: 90
系列: Spartan®-II
LAB/CLB數(shù): 600
邏輯元件/單元數(shù): 2700
RAM 位總計: 40960
輸入/輸出數(shù): 176
門數(shù): 100000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 256-BGA
供應(yīng)商設(shè)備封裝: 256-FBGA(17x17)
Spartan-II FPGA Family: Pinout Tables
DS001-4 (v2.8) June 13, 2008
Module 4 of 4
Product Specification
71
R
Package Thermal Characteristics
Table 39 provides the thermal characteristics for the various
Spartan-II FPGA package offerings. This information is also
available using the Thermal Query tool on xilinx.com
The junction-to-case thermal resistance (
θJC) indicates the
difference between the temperature measured on the
package body (case) and the die junction temperature per
watt of power consumption. The junction-to-board (
θJB)
value similarly reports the difference between the board and
junction temperature. The junction-to-ambient (
θJA) value
reports the temperature difference between the ambient
environment and the junction temperature. The
θJA value is
reported at different air velocities, measured in linear feet
per minute (LFM). The “Still Air (0 LFM)” column shows the
θJA value in a system without a fan. The thermal resistance
drops with increasing air flow.
Table 39: Spartan-II Package Thermal Characteristics
Package
Device
Junction-to-Case
(
θJC)
Junction-to-
Board (
θJB)
Junction-to-Ambient (
θJA)
at Different Air Flows
Units
Still Air
(0 LFM)
250 LFM
500 LFM
750 LFM
VQ100
VQG100
XC2S15
11.3
N/A
44.1
36.7
34.2
33.3
°C/Watt
XC2S30
10.1
N/A
40.7
33.9
31.5
30.8
°C/Watt
TQ144
TQG144
XC2S15
7.3
N/A
38.6
30.0
25.7
24.1
°C/Watt
XC2S30
6.7
N/A
34.7
27.0
23.1
21.7
°C/Watt
XC2S50
5.8
N/A
32.2
25.1
21.4
20.1
°C/Watt
XC2S100
5.3
N/A
31.4
24.4
20.9
19.6
°C/Watt
CS144
CSG144
XC2S30
2.8
N/A
34.0
26.0
23.9
23.2
°C/Watt
PQ208
PQG208
XC2S50
6.7
N/A
25.2
18.6
16.4
15.2
°C/Watt
XC2S100
5.9
N/A
24.6
18.1
16.0
14.9
°C/Watt
XC2S150
5.0
N/A
23.8
17.6
15.6
14.4
°C/Watt
XC2S200
4.1
N/A
23.0
17.0
15.0
13.9
°C/Watt
FG256
FGG256
XC2S50
7.1
17.6
27.2
21.4
20.3
19.8
°C/Watt
XC2S100
5.8
15.1
25.1
19.5
18.3
17.8
°C/Watt
XC2S150
4.6
12.7
23.0
17.6
16.3
15.8
°C/Watt
XC2S200
3.5
10.7
21.4
16.1
14.7
14.2
°C/Watt
FG456
FGG456
XC2S150
2.0
N/A
21.9
17.3
15.8
15.2
°C/Watt
XC2S200
2.0
N/A
21.0
16.6
15.1
14.5
°C/Watt
相關(guān)PDF資料
PDF描述
93LC76B-E/SN IC EEPROM 8KBIT 2MHZ 8SOIC
XC6SLX16-3CPG196I IC FPGA SPARTAN 6 14K 196CPGBGA
25LC020AT-E/OT IC EEPROM 2KBIT 10MHZ SOT23-6
24LC16BT-E/MC IC EEPROM 16KBIT 400KHZ 8DFN
24FC64T-I/ST IC EEPROM 64KBIT 1MHZ 8TSSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC2S1005FG456C 制造商:Xilinx 功能描述:
XC2S100-5FG456C 功能描述:IC FPGA 2.5V 600 CLB'S 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計:226304 輸入/輸出數(shù):131 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應(yīng)商設(shè)備封裝:208-PQFP(28x28)
XC2S100-5FG456I 功能描述:IC FPGA 2.5V I-TEMP 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-II 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計:3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA(34.55x34.55)
XC2S100-5FGG256C 功能描述:IC SPARTAN-II FPGA 100K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC2S100-5FGG256I 功能描述:IC SPARTAN-II FPGA 100K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)