參數(shù)資料
型號(hào): XC2S100-5FG456C
廠商: Xilinx Inc
文件頁(yè)數(shù): 40/99頁(yè)
文件大?。?/td> 0K
描述: IC FPGA 2.5V 600 CLB'S 456-FBGA
標(biāo)準(zhǔn)包裝: 1
系列: Spartan®-II
LAB/CLB數(shù): 600
邏輯元件/單元數(shù): 2700
RAM 位總計(jì): 40960
輸入/輸出數(shù): 196
門數(shù): 100000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 456-BBGA
供應(yīng)商設(shè)備封裝: 456-FBGA
產(chǎn)品目錄頁(yè)面: 599 (CN2011-ZH PDF)
其它名稱: 122-1227
XC2S100-5FG456C-ND
Spartan-II FPGA Family: Functional Description
DS001-2 (v2.8) June 13, 2008
Module 2 of 4
Product Specification
45
R
HSTL Class III
A sample circuit illustrating a valid termination technique for
HSTL_III appears in Figure 45. DC voltage specifications
appear in Table 23 for the HSTL_III standard. See "DC
Specifications" in Module 3 for the actual FPGA
characteristics.
HSTL Class IV
A sample circuit illustrating a valid termination technique for
HSTL_IV appears in Figure 46.DC voltage specifications
appear in Table 23 for the HSTL_IV standard. See "DC
Specifications" in Module 3 for the actual FPGA
characteristics
Figure 45: Terminated HSTL Class III
Table 23: HSTL Class III Voltage Specification
Parameter
Min
Typ
Max
VCCO
1.40
1.50
1.60
VREF (1)
-0.90
-
VTT
-VCCO
-
VIH
VREF + 0.1
-
VIL
--
VREF – 0.1
VOH
VCCO – 0.4
-
VOL
--
0.4
IOH at VOH (mA)
–8
-
IOL at VOL (mA)
24
-
Notes:
1.
Per EIA/JESD8-6, "The value of VREF is to be selected by the
user to provide optimum noise margin in the use conditions
specified by the user."
VREF = 0.9V
VCCO = 1.5V
50
Ω
Z = 50
HSTL Class III
DS001_45_061200
VTT = 1.5V
Figure 46: Terminated HSTL Class IV
Table 24: HSTL Class IV Voltage Specification
Parameter
Min
Typ
Max
VCCO
1.40
1.50
1.60
VREF
-0.90
-
VTT
-VCCO
-
VIH
VREF + 0.1
-
VIL
--
VREF – 0.1
VOH
VCCO – 0.4
-
VOL
--
0.4
IOH at VOH (mA)
–8
-
IOL at VOL (mA)
48
-
Notes:
1.
Per EIA/JESD8-6, "The value of VREF is to be selected by the
user to provide optimum noise margin in the use conditions
specified by the user."
VREF = 0.9V
VCCO = 1.5V
50
Ω
Z = 50
HSTL Class IV
DS001_46_061200
VTT = 1.5V
50
Ω
VTT = 1.5V
相關(guān)PDF資料
PDF描述
GBM06DRKN-S13 CONN EDGECARD 12POS .156 EXTEND
VI-21J-EU CONVERTER MOD DC/DC 36V 200W
LQG15HS56NJ02D INDUCTOR 56NH 200MA 0402
GBM06DRKH-S13 CONN EDGECARD 12POS .156 EXTEND
ADSP-BF531SBB400 IC DSP CTLR 16BIT 400MHZ 169-BGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC2S100-5FG456I 功能描述:IC FPGA 2.5V I-TEMP 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Spartan®-II 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA(34.55x34.55)
XC2S100-5FGG256C 功能描述:IC SPARTAN-II FPGA 100K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC2S100-5FGG256I 功能描述:IC SPARTAN-II FPGA 100K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC2S100-5FGG456C 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-II FPGA Family
XC2S100-5FGG456I 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-II FPGA Family