參數(shù)資料
型號: XC2S100-5FG456C
廠商: Xilinx Inc
文件頁數(shù): 67/99頁
文件大小: 0K
描述: IC FPGA 2.5V 600 CLB'S 456-FBGA
標(biāo)準(zhǔn)包裝: 1
系列: Spartan®-II
LAB/CLB數(shù): 600
邏輯元件/單元數(shù): 2700
RAM 位總計: 40960
輸入/輸出數(shù): 196
門數(shù): 100000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 456-BBGA
供應(yīng)商設(shè)備封裝: 456-FBGA
產(chǎn)品目錄頁面: 599 (CN2011-ZH PDF)
其它名稱: 122-1227
XC2S100-5FG456C-ND
DS001-2 (v2.8) June 13, 2008
Module 2 of 4
Product Specification
7
2000-2008 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other
trademarks are the property of their respective owners.
Architectural Description
Spartan-II FPGA Array
The Spartan-II field-programmable gate array, shown in
Figure 2, is composed of five major configurable elements:
IOBs provide the interface between the package pins
and the internal logic
CLBs provide the functional elements for constructing
most logic
Dedicated block RAM memories of 4096 bits each
Clock DLLs for clock-distribution delay compensation
and clock domain control
Versatile multi-level interconnect structure
As can be seen in Figure 2, the CLBs form the central logic
structure with easy access to all support and routing
structures. The IOBs are located around all the logic and
memory elements for easy and quick routing of signals on
and off the chip.
Values stored in static memory cells control all the
configurable logic elements and interconnect resources.
These values load into the memory cells on power-up, and
can reload if necessary to change the function of the device.
Each of these elements will be discussed in detail in the
following sections.
Input/Output Block
The Spartan-II FPGA IOB, as seen in Figure 2, features
inputs and outputs that support a wide variety of I/O
signaling standards. These high-speed inputs and outputs
are capable of supporting various state of the art memory
and bus interfaces. Table 3 lists several of the standards
which are supported along with the required reference,
output and termination voltages needed to meet the
standard.
50
Spartan-II FPGA Family:
Functional Description
DS001-2 (v2.8) June 13, 2008
Product Specification
R
Figure 2: Spartan-II FPGA Input/Output Block (IOB)
Package Pin
Package
Pin
Package Pin
D
CK
EC
SR
Q
D
CK
EC
SR
Q
D
CK
EC
SR
Q
Programmable
Bias &
ESD Network
VCCO
I/O
I/O, VREF
Internal
Reference
To Next I/O
To Other
External VREF Inputs
of Bank
Programmable
Input Buffer
Programmable
Output Buffer
Programmable
Delay
VCC
OE
SR
O
OCE
I
ICE
IQ
CLK
TCE
T
DS001_02_090600
TFF
OFF
IFF
相關(guān)PDF資料
PDF描述
GBM06DRKN-S13 CONN EDGECARD 12POS .156 EXTEND
VI-21J-EU CONVERTER MOD DC/DC 36V 200W
LQG15HS56NJ02D INDUCTOR 56NH 200MA 0402
GBM06DRKH-S13 CONN EDGECARD 12POS .156 EXTEND
ADSP-BF531SBB400 IC DSP CTLR 16BIT 400MHZ 169-BGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC2S100-5FG456I 功能描述:IC FPGA 2.5V I-TEMP 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-II 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計:3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA(34.55x34.55)
XC2S100-5FGG256C 功能描述:IC SPARTAN-II FPGA 100K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC2S100-5FGG256I 功能描述:IC SPARTAN-II FPGA 100K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC2S100-5FGG456C 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-II FPGA Family
XC2S100-5FGG456I 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-II FPGA Family