參數(shù)資料
型號(hào): XC2S100-5FG456C
廠商: Xilinx Inc
文件頁(yè)數(shù): 78/99頁(yè)
文件大?。?/td> 0K
描述: IC FPGA 2.5V 600 CLB'S 456-FBGA
標(biāo)準(zhǔn)包裝: 1
系列: Spartan®-II
LAB/CLB數(shù): 600
邏輯元件/單元數(shù): 2700
RAM 位總計(jì): 40960
輸入/輸出數(shù): 196
門數(shù): 100000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 456-BBGA
供應(yīng)商設(shè)備封裝: 456-FBGA
產(chǎn)品目錄頁(yè)面: 599 (CN2011-ZH PDF)
其它名稱: 122-1227
XC2S100-5FG456C-ND
Spartan-II FPGA Family: Functional Description
DS001-2 (v2.8) June 13, 2008
Module 2 of 4
Product Specification
8
R
The three IOB registers function either as edge-triggered
D-type flip-flops or as level-sensitive latches. Each IOB has
a clock signal (CLK) shared by the three registers and
independent Clock Enable (CE) signals for each register. In
addition to the CLK and CE control signals, the three
registers share a Set/Reset (SR). For each register, this
signal can be independently configured as a synchronous
Set, a synchronous Reset, an asynchronous Preset, or an
asynchronous Clear.
A feature not shown in the block diagram, but controlled by
the software, is polarity control. The input and output buffers
and all of the IOB control signals have independent polarity
controls.
Optional pull-up and pull-down resistors and an optional
weak-keeper circuit are attached to each pad. Prior to
configuration all outputs not involved in configuration are
forced into their high-impedance state. The pull-down
resistors and the weak-keeper circuits are inactive, but
inputs may optionally be pulled up.
The activation of pull-up resistors prior to configuration is
controlled on a global basis by the configuration mode pins.
If the pull-up resistors are not activated, all the pins will float.
Consequently, external pull-up or pull-down resistors must
be provided on pins required to be at a well-defined logic
level prior to configuration.
All pads are protected against damage from electrostatic
discharge (ESD) and from over-voltage transients. Two
forms of over-voltage protection are provided, one that
permits 5V compliance, and one that does not. For 5V
compliance, a zener-like structure connected to ground
turns on when the output rises to approximately 6.5V. When
5V compliance is not required, a conventional clamp diode
may be connected to the output supply voltage, VCCO. The
type of over-voltage protection can be selected
independently for each pad.
All Spartan-II FPGA IOBs support IEEE 1149.1-compatible
boundary scan testing.
Input Path
A buffer In the Spartan-II FPGA IOB input path routes the
input signal either directly to internal logic or through an
optional input flip-flop.
An optional delay element at the D-input of this flip-flop
eliminates pad-to-pad hold time. The delay is matched to
the internal clock-distribution delay of the FPGA, and when
used, assures that the pad-to-pad hold time is zero.
Each input buffer can be configured to conform to any of the
low-voltage signaling standards supported. In some of
these standards the input buffer utilizes a user-supplied
threshold voltage, VREF. The need to supply VREF imposes
constraints on which standards can used in close proximity
to each other. See "I/O Banking," page 9.
There are optional pull-up and pull-down resistors at each
input for use after configuration.
Output Path
The output path includes a 3-state output buffer that drives
the output signal onto the pad. The output signal can be
routed to the buffer directly from the internal logic or through
an optional IOB output flip-flop.
The 3-state control of the output can also be routed directly
from the internal logic or through a flip-flip that provides
synchronous enable and disable.
Each output driver can be individually programmed for a
wide range of low-voltage signaling standards. Each output
buffer can source up to 24 mA and sink up to 48 mA. Drive
strength and slew rate controls minimize bus transients.
In most signaling standards, the output high voltage
depends on an externally supplied VCCO voltage. The need
to supply VCCO imposes constraints on which standards
can be used in close proximity to each other. See "I/O
An optional weak-keeper circuit is connected to each
output. When selected, the circuit monitors the voltage on
the pad and weakly drives the pin High or Low to match the
input signal. If the pin is connected to a multiple-source
signal, the weak keeper holds the signal in its last state if all
Table 3: Standards Supported by I/O (Typical Values)
I/O Standard
Input
Reference
Voltage
(VREF)
Output
Source
Voltage
(VCCO)
Board
Termination
Voltage
(VTT)
LVTTL (2-24 mA)
N/A
3.3
N/A
LVCMOS2
N/A
2.5
N/A
PCI (3V/5V,
33 MHz/66 MHz)
N/A
3.3
N/A
GTL
0.8
N/A
1.2
GTL+
1.0
N/A
1.5
HSTL Class I
0.75
1.5
0.75
HSTL Class III
0.9
1.5
HSTL Class IV
0.9
1.5
SSTL3 Class I
and II
1.5
3.3
1.5
SSTL2 Class I
and II
1.25
2.5
1.25
CTT
1.5
3.3
1.5
AGP-2X
1.32
3.3
N/A
相關(guān)PDF資料
PDF描述
GBM06DRKN-S13 CONN EDGECARD 12POS .156 EXTEND
VI-21J-EU CONVERTER MOD DC/DC 36V 200W
LQG15HS56NJ02D INDUCTOR 56NH 200MA 0402
GBM06DRKH-S13 CONN EDGECARD 12POS .156 EXTEND
ADSP-BF531SBB400 IC DSP CTLR 16BIT 400MHZ 169-BGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC2S100-5FG456I 功能描述:IC FPGA 2.5V I-TEMP 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Spartan®-II 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA(34.55x34.55)
XC2S100-5FGG256C 功能描述:IC SPARTAN-II FPGA 100K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC2S100-5FGG256I 功能描述:IC SPARTAN-II FPGA 100K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC2S100-5FGG456C 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-II FPGA Family
XC2S100-5FGG456I 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-II FPGA Family