參數(shù)資料
型號(hào): XC3S1000-4FTG256I
廠商: Xilinx Inc
文件頁(yè)數(shù): 101/272頁(yè)
文件大?。?/td> 0K
描述: SPARTAN-3A FPGA 1M STD 256-FTBGA
產(chǎn)品培訓(xùn)模塊: Extended Spartan 3A FPGA Family
標(biāo)準(zhǔn)包裝: 90
系列: Spartan®-3
LAB/CLB數(shù): 1920
邏輯元件/單元數(shù): 17280
RAM 位總計(jì): 442368
輸入/輸出數(shù): 173
門數(shù): 1000000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-FTBGA
配用: 122-1502-ND - KIT STARTER SPARTAN-3 PCI-E
其它名稱: 122-1709
XC3S1000-4FTG256I-ND
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Spartan-3 FPGA Family: Functional Description
DS099 (v3.1) June 27, 2013
Product Specification
19
The DCI feature operates independently for each of the device’s eight banks. Each bank has an ‘N’ reference pin (VRN) and
a ‘P’ reference pin, (VRP), to calibrate driver and termination resistance. Only when using a DCI standard on a given bank
do these two pins function as VRN and VRP. When not using a DCI standard, the two pins function as user I/Os. As shown
in Figure 9, add an external reference resistor to pull the VRN pin up to VCCO and another reference resistor to pull the VRP
pin down to GND. Also see Figure 42, page 116. Both resistors have the same value—commonly 50
Ω—with one-percent
tolerance, which is either the characteristic impedance of the line or twice that, depending on the DCI standard in use.
Standards having a symbol name that contains the letters “DV2” use a reference resistor value that is twice the line
impedance. DCI adjusts the output driver impedance to match the reference resistors’ value or half that, according to the
standard. DCI always adjusts the on-chip termination resistors to directly match the reference resistors’ value.
The rules guiding the use of DCI standards on banks are as follows:
No more than one DCI I/O standard with a Single Termination is allowed per bank.
No more than one DCI I/O standard with a Split Termination is allowed per bank.
Single Termination, Split Termination, Controlled- Impedance Driver, and Controlled-Impedance Driver with Half
Impedance can co-exist in the same bank.
The Organization of IOBs into Banks
IOBs are allocated among eight banks, so that each side of the device has two banks, as shown in Figure 10. For all
packages, each bank has independent VREF lines. For example, VREF Bank 3 lines are separate from the VREF lines going
to all other banks.
For the Very Thin Quad Flat Pack (VQ), Plastic Quad Flat Pack (PQ), Fine Pitch Thin Ball Grid Array (FT), and Fine Pitch Ball
Grid Array (FG) packages, each bank has dedicated VCCO lines. For example, the VCCO Bank 7 lines are separate from the
VCCO lines going to all other banks. Thus, Spartan-3 devices in these packages support eight independent VCCO supplies.
X-Ref Target - Figure 9
Figure 9: Connection of Reference Resistors (RREF)
X-Ref Target - Figure 10
Figure 10: Spartan-3 FPGA I/O Banks (Top View)
DS099-2_04_082104
VCCO
VRN
VRP
One of eight
I/O Banks
RREF (1%)
DS099-2_03_082104
Bank 0
Bank 1
Bank 5
Bank 4
Bank
7
Bank
6
Bank
2
Bank
3
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