參數(shù)資料
型號(hào): XCV405E-7FG676C
廠商: Xilinx Inc
文件頁(yè)數(shù): 34/118頁(yè)
文件大?。?/td> 0K
描述: IC FPGA 1.8V C-TEMP 676-FBGA
產(chǎn)品變化通告: FPGA Family Discontinuation 18/Apr/2011
標(biāo)準(zhǔn)包裝: 1
系列: Virtex®-E EM
LAB/CLB數(shù): 2400
邏輯元件/單元數(shù): 10800
RAM 位總計(jì): 573440
輸入/輸出數(shù): 404
門數(shù): 129600
電源電壓: 1.71 V ~ 1.89 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 676-BGA
供應(yīng)商設(shè)備封裝: 676-FBGA(27x27)
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)當(dāng)前第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)
Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays
Module 2 of 4
DS025-2 (v3.0) March 21, 2014
18
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Configuration through the TAP uses the CFG_IN instruc-
tion. This instruction allows data input on TDI to be con-
verted into data packets for the internal configuration bus.
The following steps are required to configure the FPGA
through the boundary-scan port (when using TCK as a
start-up clock).
1.
Load the CFG_IN instruction into the boundary-scan
instruction register (IR)
2.
Enter the Shift-DR (SDR) state
3.
Shift a configuration bitstream into TDI
4.
Return to Run-Test-Idle (RTI)
5.
Load the JSTART instruction into IR
6.
Enter the SDR state
7.
Clock TCK through the startup sequence
8.
Return to RTI
Configuration and readback via the TAP is always available.
The boundary-scan mode is selected by a <101> or <001>
on the mode pins (M2, M1, M0). For details on TAP charac-
teristics, refer to XAPP139.
Configuration Sequence
The configuration of Virtex-E devices is a three-phase pro-
cess. First, the configuration memory is cleared. Next, con-
figuration data is loaded into the memory, and finally, the
logic is activated by a start-up process.
Configuration is automatically initiated on power-up unless
it is delayed by the user, as described below. The configura-
tion process can also be initiated by asserting PROGRAM.
The end of the memory-clearing phase is signalled by INIT
going High, and the completion of the entire process is sig-
nalled by DONE going High.
The power-up timing of configuration signals is shown in
The corresponding timing characteristics are listed in
Delaying Configuration
INIT can be held Low using an open-drain driver. An
open-drain is required since INIT is a bidirectional
open-drain pin that is held Low by the FPGA while the con-
figuration memory is being cleared. Extending the time that
the pin is Low causes the configuration sequencer to wait.
Thus, configuration is delayed by preventing entry into the
phase where data is loaded.
Start-Up Sequence
The default Start-up sequence is that one CCLK cycle after
DONE goes High, the global 3-state signal (GTS) is
released. This permits device outputs to turn on as neces-
sary.
One CCLK cycle later, the Global Set/Reset (GSR) and
Global Write Enable (GWE) signals are released. This per-
Figure 20: Power-Up Timing Configuration Signals
VALI
PROGRAM
Vcc
CCLK OUTPUT or INPUT
M0, M1, M2
(Required)
TPL
TICCK
ds022_020_071201
TPOR
INIT
Table 12:
Power-up Timing Characteristics
Description
Symbol
Value
Units
Power-on Reset1
TPOR
2.0
ms, max
Program Latency
TPL
100.0
μs, max
CCLK (output) Delay
TICCK
0.5
μs, min
4.0
μs, max
Program Pulse Width
TPROGRAM
300
ns, min
Notes:
1.
TPOR delay is the initialization time required after VCCINT
reaches the recommended operating voltage.
相關(guān)PDF資料
PDF描述
BR93L86RFVT-WE2 IC EEPROM 16KBIT 2MHZ 8TSSOP
XCV405E-6FG676I IC FPGA 1.8V 676-BGA
BR93L86RFVM-WTR IC EEPROM 16KBIT 2MHZ 8MSOP
BR93L86RFV-WE2 IC EEPROM 16KBIT 2MHZ 8SSOP
BR25L020FV-WE2 IC EEPROM SER 2KB SPI BUS 8SSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XCV405E-7FG676I 功能描述:IC FPGA 1.8V 676-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Virtex®-E EM 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XCV405E-7FG900C 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays
XCV405E-7FG900I 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays
XCV405E-8BG404C 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays
XCV405E-8BG404I 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays