參數(shù)資料
型號: 28F032B3
廠商: Intel Corp.
英文描述: SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
中文描述: 智能高級啟動3座4 - ,8 - ,16 - ,32 - Mbit閃存家庭
文件頁數(shù): 1/48頁
文件大小: 304K
代理商: 28F032B3
E
PRELIMINARY
July 1998
Order Number: 290580-005
n
Flexible SmartVoltage Technology
2.7 V
–3.6 V Read/Program/Erase
12 V V
PP
Fast Production
Programming
n
2.7 V or 1.65 V I/O Option
Reduces Overall System Power
n
High Performance
2.7 V–3.6 V: 90 ns Max Access Time
3.0 V–3.6 V: 80 ns Max Access Time
n
Optimized Block Sizes
Eight 8-KB Blocks for Data,
Top or Bottom Locations
Up to Sixty-Three 64-KB Blocks for
Code
n
Block Locking
V
CC
-Level Control through WP#
n
Low Power Consumption
10 mA Typical Read Current
n
Absolute Hardware-Protection
V
PP
= GND Option
V
CC
Lockout Voltage
n
Extended Temperature Operation
–40 °C to +85 °C
n
Flash Data Integrator Software
Flash Memory Manager
System Interrupt Manager
Supports Parameter Storage,
Streaming Data (e.g., Voice)
n
Automated Program and Block Erase
Status Registers
n
Extended Cycling Capability
Minimum 100,000 Block Erase
Cycles Guaranteed
n
Automatic Power Savings Feature
Typical I
CCS
after Bus Inactivity
n
Standard Surface Mount Packaging
48-Ball
μ
BGA* Package
48-Lead TSOP Package
40-Lead TSOP Package
n
Footprint Upgradeable
Upgrade Path for 4-, 8-, 16-, and 32-
Mbit Densities
n
ETOX VI (0.25
μ)
Flash Technology
The Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.25 μ technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and
interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single
device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective,
monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40-
lead and 48-lead TSOP and 48-ball μBGA* packages. Additional information on this product family can be
obtained by accessing Intel’s WWW page: http://www.intel.com/design/flash.
SMART 3 ADVANCED BOOT BLOCK
4-, 8-, 16-, 32-MBIT
FLASH MEMORY FAMILY
28F400B3, 28F800B3, 28F160B3, 28F320B3
28F008B3, 28F016B3, 28F032B3
相關(guān)PDF資料
PDF描述
28F160B3 SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
28F800B3 SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
28F016SA16-MBIT Evaluation Kit/Evaluation System for the MAX5954L/MAX5954A
28F016SV 16-MBIT (1 MBIT x 16, 2 MBIT x 8) FlashFile MEMORY
28F016SA 16-Mbit(1 Mbit x 16, 2 Mbit x 8) FlashFile Memory(16-M位(1 M位 x 16, 2 M位 x 8) FlashFile存儲器)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
28F032C3 制造商:未知廠家 制造商全稱:未知廠家 功能描述:3 VOLT ADVANCED+ BOOT BLOCK. 8-. 16-. 32-MBIT FLASH MEMORY FAMILY
28F0330-2SR 制造商:Steward/Laird Tech 功能描述:
28F04181SR 制造商:STEWARD 功能描述:New
28F0428-0T0 功能描述:FERRITE FILTER 4 LINE PCB RoHS:是 類別:濾波器 >> 鐵氧體磁珠和芯片 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:EMI1812 頻率對應(yīng)阻抗:120 歐姆 @ 100MHz 額定電流:200mA DC 電阻(DCR):最大 400 毫歐 濾波器類型:差模 - 單線 封裝/外殼:1812(4532 公制) 安裝類型:表面貼裝 包裝:帶卷 (TR) 高度(最大):0.069"(1.75mm) 尺寸/尺寸:0.177" L x 0.126" W(4.50mm x 3.20mm) 其它名稱:Q1712807A
28F0430-2SR 制造商:Laird Technologies Inc 功能描述:28F0430-2SR