
Electrical Characteristics
148
Intel
82845G/82845GL/82845GV GMCH Datasheet
6.3
Power Characteristics
NOTES:
1. See
Intel
845G/845GL/845GV Chipset: Intel
82845G/82845GL/82845GV Graphics and Memory Controller
Hub (GMCH) Thermal and Mechanical Design Guidelines
for more information.
2. These current levels may happen simultaneously and can be summed into one supply.
6.4
Signal Groups
The signal description includes the type of buffer used for the particular signal (see
Table 6-4
):
AGTL+
Open Drain AGTL+ interface signal. Refer to the AGTL+ I/O Specification
for complete details. The GMCH integrates most AGTL+ termination
resistors.
AGP interface signals. These signals are compatible with
AGP 2.0 1.5 V
Signaling Environment DC and AC Specifications
. The buffers are not 3.3 V
tolerant. (DVO signals use the same buffers as AGP)
Hub Interface 1.5 V CMOS buffers.
DDR System memory 2.5 V CMOS buffers.
AGP
HI CMOS
DDR CMOS
SDR CMOS
SDR System memory 3.3 V CMOS buffers.
Table 6-3. Power Characteristics
Symbol
Parameter
Max
Unit
Notes
P
GMCH(DDR)
P
GMCH(SDR)
I
VCC(DDR)
I
VCC(SDR)
I
VCCAGP
I
VCCAGP
I
VCCHI
I
VTTFSB
I
VCCSM(DDR)
I
SUS_2.5
I
VCCSM(SDR)
I
SUS_3.3
Thermal Design Power
W
1
Thermal Design Power
W
1
1.5 V Core Supply Current
2.46
A
2
1.5 V Core Supply Current
2.0
A
2
1.5 V AGP Supply Current (AGP mode)
0.37
A
2
1.5 V AGP Supply Current (DVO mode)
0.18
A
2
1.5 V Hub Interface Supply Current
90
mA
2
GMCH VTT supply Current
2.4
A
DDR System Memory Interface (2.5 V) Supply Current
2.2
A
2.5 V Standby Supply Current
95
mA
SDR System Memory Interface (3.3 V) Supply Current
1.6
A
3.3 V Standby Supply Current
5
mA
Table 6-4. Signal Groups (Sheet 1 of 2)
Signal
Group
Signal Type
Signals
AGP Interface Signal Groups
(a)
AGP I/O
GADSTB_[1:0], GADSTB_[1:0]#, GFRAME#, GIRDY#, GTRDY#,
GSTOP#, GDEVSEL#, GAD_[31:0], GC/BE_[3:0]#, GPAR
(b)
AGP Input
GPIPE#, GSBA_[7:0], GRBF#, GWBF#, GSBSTB, GSBSTB#, GREQ#
(c)
AGP Output
GST_[2:0], GGNT#
(d)
AGP Miscellaneous
AGP_VREF, AGP_RCOMP