參數(shù)資料
型號(hào): AM29LV256MH128EI
廠商: ADVANCED MICRO DEVICES INC
元件分類: PROM
英文描述: 16M X 16 FLASH 3V PROM, 120 ns, PDSO56
封裝: TSOP-56
文件頁(yè)數(shù): 22/63頁(yè)
文件大?。?/td> 1515K
代理商: AM29LV256MH128EI
September 9, 2002
Am29LV256M
29
A D VA NCE
I N FO RM ATIO N
Table 6.
System Interface String
Table 7.
Device Geometry Definition
Addresses (x16)
Data
Description
1Bh
0027h
V
CC Min. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Ch
0036h
V
CC Max. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Dh
0000h
V
PP Min. voltage (00h = no VPP pin present)
1Eh
0000h
V
PP Max. voltage (00h = no VPP pin present)
1Fh
0007h
Typical timeout per single byte/word write 2
N s
20h
0007h
Typical timeout for Min. size buffer write 2
N
s (00h = not supported)
21h
000Ah
Typical timeout per individual block erase 2
N ms
22h
0000h
Typical timeout for full chip erase 2
N ms (00h = not supported)
23h
0001h
Max. timeout for byte/word write 2
N times typical
24h
0005h
Max. timeout for buffer write 2
N times typical
25h
0004h
Max. timeout per individual block erase 2
N times typical
26h
0000h
Max. timeout for full chip erase 2
N times typical (00h = not supported)
Addresses (x16)
Data
Description
27h
0019h
Device Size = 2
N byte
28h
29h
0002h
0000h
Flash Device Interface description (refer to CFI publication 100)
2Ah
2Bh
0005h
0000h
Max. number of byte in multi-byte write = 2
N
(00h = not supported)
2Ch
0001h
Number of Erase Block Regions within device (01h = uniform device, 02h = boot
device)
2Dh
2Eh
2Fh
30h
01FFh
0001h
0000h
0001h
Erase Block Region 1 Information
(refer to the CFI specification or CFI publication 100)
31h
32h
33h
34h
0000h
Erase Block Region 2 Information (refer to CFI publication 100)
35h
36h
37h
38h
0000h
Erase Block Region 3 Information (refer to CFI publication 100)
39h
3Ah
3Bh
3Ch
0000h
Erase Block Region 4 Information (refer to CFI publication 100)
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