- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄166216 > AM29LV256MH128EI (ADVANCED MICRO DEVICES INC) 16M X 16 FLASH 3V PROM, 120 ns, PDSO56 PDF資料下載
參數(shù)資料
| 型號(hào)： | AM29LV256MH128EI |
| 廠(chǎng)商： | ADVANCED MICRO DEVICES INC |
| 元件分類(lèi)： | PROM |
| 英文描述： | 16M X 16 FLASH 3V PROM, 120 ns, PDSO56 |
| 封裝： | TSOP-56 |
| 文件頁(yè)數(shù)： | 59/63頁(yè) |
| 文件大?。?/td> | 1515K |
| 代理商： | AM29LV256MH128EI |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)當(dāng)前第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)
62
Am29LV256M
September 9, 2002
A D VA NCE
I N FO RM ATIO N
PHYSICAL DIMENSIONS
LAC064—64-Ball Fortified Ball Grid Array
18 x 12 mm Package
3203\16-038.12c
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
(EXCEPT AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN
THE "E" DIRECTION. N IS THE TOTAL NUMBER OF SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER
ROW PARALLEL TO THE D OR E DIMENSION, RESPECTIVELY,
SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
NOT USED.
9.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
18.00 mm x 12.00 mm
PACKAGE
LAC 064
NOM.
---
1.40
---
MAX.
12.00 BSC.
18.00 BSC.
8
---
MIN.
0.60
0.40
7.00 BSC.
8
64
0.60
0.70
0.50 BSC
A1-A8, K1-K8
0.50
1.00 BSC
ME
D
JEDEC
PACKAGE
SYMBOL
A
A2
A1
MD
D1
E
E1
N
NOTE
DEPOPULATED SOLDER BALLS
MATRIX SIZE E DIRECTION
MATRIX FOOTPRINT
BALL PITCH - D DIRECTION
1.00 BSC
BALL PITCH - E DIRECTION
SOLDER BALL PLACEMENT
BODY SIZE
STANDOFF
BODY SIZE
BODY THICKNESS
PROFILE HEIGHT
BALL DIAMETER
MATRIX SIZE D DIRECTION
BALL COUNT
MATRIX FOOTPRINT
eD
eE
SD/SE
b
O
BOTTOM VIEW
SIDE VIEW
TOP VIEW
2X
C
0.20
C
0.20
6
7
A
M
M C
C
o0.10
o0.25
B
C
0.25
0.15 C
A
B
C
SEATING PLANE
NXob
J
K
eD
(INK OR LASER)
CORNER
A1
A2
D
E
o0.50
A1 CORNER ID.
1.00±0.5
A
A1
CORNER
A1
SD
SE
eE
E1
D1
1
2
3
4
5
6
7
8
A
CB
D
FE
G
H
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM29LV256MH118REI | 16M X 16 FLASH 3V PROM, 110 ns, PDSO56 |
| AM29PDL127H83PCIN | 128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only, Page Mode Simultaneous Read/Write Flash Memory with Enhanced VersatileIO Control |
| AM29PDL127H83VKIN | 128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only, Page Mode Simultaneous Read/Write Flash Memory with Enhanced VersatileIO Control |
| AM29PDL127H85PCI | 128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only, Page Mode Simultaneous Read/Write Flash Memory with Enhanced VersatileIO Control |
| AM29PDL127H85PCIN | 128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only, Page Mode Simultaneous Read/Write Flash Memory with Enhanced VersatileIO Control |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM29LV256MH94REI | 制造商:Spansion 功能描述:256M (32MX8/16MX16) 3V REG, MIRRORBIT, TSOP56, IND - Trays |
| AM29LV320DB120EI | 制造商:Spansion 功能描述:Flash Mem Parallel 3V/3.3V 32M-Bit 4M x 8/2M x 16 120ns 48-Pin TSOP |
| AM29LV320DB120WMI | 制造商:Spansion 功能描述:Flash Mem Parallel 3V/3.3V 32M-Bit 4M x 8/2M x 16 120ns 48-Pin FBGA |
| AM29LV320DB90EC | 制造商:Spansion 功能描述:Flash Mem Parallel 3V/3.3V 32M-Bit 4M x 8/2M x 16 90ns 48-Pin TSOP |
| AM29LV320DB90ED | 制造商:Spansion 功能描述:Flash Mem Parallel 3V/3.3V 32M-Bit 4M x 8/2M x 16 90ns 48-Pin TSOP |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。