參數(shù)資料
型號: AM29LV256MH128EI
廠商: ADVANCED MICRO DEVICES INC
元件分類: PROM
英文描述: 16M X 16 FLASH 3V PROM, 120 ns, PDSO56
封裝: TSOP-56
文件頁數(shù): 60/63頁
文件大?。?/td> 1515K
代理商: AM29LV256MH128EI
September 9, 2002
Am29LV256M
63
A D VA NCE
I N FO RM ATIO N
REVISION SUMMARY
Revision A (August 3, 2001)
Initial release as abbreviated Advance Information
data sheet.
Revision A+1 (September 12, 2001)
Ordering Information
Changed package part number designation from WH
to PC.
Physical Dimensions
Added the TS056 and LAA064 packages.
Revision A+2 (October 3, 2001)
Global
Corrected title from 64 Mbit to 256 Mbit. Added 120 ns
speed option.
64-byte to 256-byte.
Connection Diagram
Modified fBGA ball grid to an 8 x 8 ball matrix.
Changed RFU (reserved for future use) balls to NC
(No Connection).
Ordering Information
Changed operating voltage range on 90 ns speed op-
tion to 3.0–3.6 V.
Pin Description
Added A-1 description.
Revision A+3 (March 25, 2002)
Distinctive Characteristics
Clarified description of Enhanced VersatileIO control.
Physical Dimensions
Added drawing that shows both TS056 and TSR056
specifications.
Revision B (July 1, 2002)
Expanded data sheet to full specification version.
Revision B+1 (July 10, 2002)
Ordering Information, Physcial Dimensions
Corrected package description to LAC064, 18 x 12
mm Fortified BGA.
DC Characteristics table
Deleted I
ACC specification.
Revision B+2 (September 9, 2002)
Product Selector Guide, Ordering Information,
Read-Only Operations, Erase and Program
Operations, and Alternate CE# Controlled Erase
and Program Operations
Added regulated OPNs.
Changed all OPNs that end with 4 or 9 to end with 3 or
8.
Changed all package markings that contain combina-
tions that end with 4 or 9 to end with 3 or 8.
CFI
Modified wording of last paragraph to read: “reading
array data.”
Program Suspend/Program Resume Command
Sequence
Changed 15 s typical to maximum and added 5 s
typical.
Erase Suspend/Erase Resume Commands
Changed typical from 20 s to 5 s and added a maxi-
mum of 20 s.
LAC064—64-Ball Fortified Ball Grid Array
Added final package drawing.
Trademarks
Copyright 2002 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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