參數(shù)資料
型號(hào): CY7C1472BV25-250BZXI
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類(lèi): SRAM
英文描述: 4M X 18 ZBT SRAM, 3 ns, PBGA165
封裝: 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-165
文件頁(yè)數(shù): 6/29頁(yè)
文件大小: 884K
代理商: CY7C1472BV25-250BZXI
CY7C1470BV25
CY7C1472BV25, CY7C1474BV25
Document #: 001-15032 Rev. *D
Page 14 of 29
possible to capture all other signals and simply ignore the value
of the CLK captured in the boundary scan register.
After the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary
scan register between the TDI and TDO balls.
Note that since the PRELOAD part of the command is not imple-
mented, putting the TAP to the Update-DR state while performing
a SAMPLE/PRELOAD instruction has the same effect as the
Pause-DR command.
BYPASS
When the BYPASS instruction is loaded in the instruction register
and the TAP is placed in a Shift-DR state, the bypass register is
placed between the TDI and TDO balls. The advantage of the
BYPASS instruction is that it shortens the boundary scan path
when multiple devices are connected together on a board.
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
Figure 4. TAP Timing
t
TL
Test Clock
(TCK )
123456
Test M ode Select
(TM S)
tTH
Test Data-O ut
(TDO )
tCYC
Test Data-In
(TDI)
tTM SH
tTM SS
tTDIH
tTDIS
tTDOX
tTDOV
DO N’T CA RE
UNDEFINED
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