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參數(shù)資料
| 型號： | Embedded Pentium 200 |
| 廠商： | Intel Corp. |
| 英文描述： | 32 Bit Embedded Pentium Processor with MMX Technology(32位嵌入式帶MMX技術(shù)奔騰處理器) |
| 中文描述： | 32位嵌入式MMX技術(shù)（32位嵌入式帶MMX公司的技術(shù)奔騰處理器Pentium處理器） |
| 文件頁數(shù)： | 29/46頁 |
| 文件大?。?/td> | 944K |
| 代理商： | EMBEDDED PENTIUM 200 |
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Pentium
Processor with MMX Technology
Datasheet
29
2.3
Thermal Specifications
The Pentium processor with MMX technology is specified for proper operation when case
temperature, T
CASE
, (T
C
) is within the range of 0° C to 70° C.
The power dissipation specification in Table 13 is provided for designing thermal solutions for
operation at a sustained maximum level. This is the worst-case power the device would dissipate in
a system for a sustained period of time. This number is provided to assist in the design of a thermal
solution for the device.
2.4
Measuring Thermal Values
To verify that the proper T
C
is maintained, it should be measured at the center of the package top
surface (opposite of the pins). The measurement is made in the same way with or without a
heatsink attached. When a heatsink is attached, a hole (smaller than 0.150” diameter) should be
drilled through the heatsink to allow probing the center of the package. See Figure 5 for an
illustration of how to measure T
C
.
To minimize the measurement errors, use the following approach:
Use 36-gauge or finer diameter K, T, or J type thermocouples. The laboratory testing was done
using a thermocouple made by Omega (part number 5TC-TTK-36-36).
Attach the thermocouple bead or junction to the center of the package top surface using high
thermal conductivity cements. The laboratory testing was done by using Omega Bond* (part
number OB-100).
Attach the thermocouple at a 90-degree angle as shown in Figure 5.
Table 13. Power Dissipation Requirements for Thermal Design
Measured at V
CC2
=2.8 V and V
CC3
=3.3 V
Parameter
Typical
(1)
Max
(2)
Unit
Notes
Active Power
7.9
(3)
7.3
(3)
17.0
(4)
15.7
(4)
Watts
Watts
233 MHz
200 MHz
Stop Grant/Auto Halt
Powerdown Power
2.61
2.41
Watts
Watts
233 MHz, Note 5
200 MHz, Note 5
Stop Clock Power
0.03
< 0.3
Watts
All frequencies,
Note 6
NOTES:
1. This is the typical power dissipation in a system. This value is expected to be the average value that will
be measured in a system using a typical device at V
= 2.8 V running typical applications. This value is
highly dependent upon the specific system configuration. Typical power specifications are not tested.
2. Systems must be designed to thermally dissipate the maximum active power dissipation. It is determined
using worst case instruction mix with V
CC2
= 2.8 V and V
CC3
= 3.3 V and also takes into account the
thermal time constants of the package.
3. Active Power (typ) is the average power measured in a system using a typical device running typical
applications under normal operating conditions at nominal V
and room temperature.
4. Active Power (max) is the maximum power dissipation under normal operating conditions at nominal
V
, worst-case temperature, while executing the worst case power instruction mix. Active power (max)
is equivalent to Thermal Design Power (max).
5. Stop Grant/Auto Halt Power Down Power Dissipation is determined by asserting the STPCLK# pin or
executing the HALT instruction.
6. Stop Clock Power Dissipation is determined by asserting the STPCLK# pin and then removing the
external CLK input.
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