參數(shù)資料
型號(hào): Embedded Pentium 200
廠商: Intel Corp.
英文描述: 32 Bit Embedded Pentium Processor with MMX Technology(32位嵌入式帶MMX技術(shù)奔騰處理器)
中文描述: 32位嵌入式MMX技術(shù)(32位嵌入式帶MMX公司的技術(shù)奔騰處理器Pentium處理器)
文件頁(yè)數(shù): 30/46頁(yè)
文件大?。?/td> 944K
代理商: EMBEDDED PENTIUM 200
Pentium
Processor with MMX Technology
30
Datasheet
The hole size should be smaller than 0.150” in diameter.
Make sure there is no contact between thermocouple cement and heatsink base. The contact
will affect the thermocouple reading.
2.4.1
Thermal Equations
For the Pentium processor with MMX technology, an ambient temperature, T
A
(air temperature
around the processor), is not specified directly. The only restriction is that T
C
is met. To calculate
T
A
values, use the following equations:
T
A
= T
C
– (
P
*
θ
CA
)
θ
CA
=
θ
JA
-
θ
JC
Where:
T
A
and T
C
=Ambient and case temperature (°C)
θ
CA
=
Case-to-ambient thermal resistance (oC/Watt)
θ
JA
=
Junction-to-ambient thermal resistance (oC/Watt)
θ
JC
=
Junction-to-case thermal resistance (oC/Watt)
P
=
Maximum power consumption (Watt)
Table 14 lists the
θ
JC
and
θ
CA
values for the Pentium processor with MMX technology and a
passive heatsink.
θ
JC
is thermal resistance from die to package case.
θ
JC
values shown in these
tables are typical values. The actual
θ
JC
values depend on actual thermal conductivity and process
of die attach.
θ
CA
is thermal resistance from package case to the ambient.
θ
CA
values shown in
these tables are typical values. The actual
θ
CA
values depend on the heatsink design, the interface
between the heatsink and the package, the air flow in the system, and thermal interactions between
the processor and the surrounding components through the printed-circuit board and the ambient
air. Figure 6 is a graph of the data from Table 14.
Thermal data collection parameters:
Heatsinks are omni-directional pin aluminum alloy
Features were based on standard extrusion practices for a given height
Pin size ranged from 50 to 129 mils
Pin spacing ranged from 93 to 175 mils
Base thickness ranged from 79 to 200 mils
Heatsink attach was 0.005” of thermal grease
Attach thickness of 0.002" will improve performance approximately 0.3o C/Watt
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