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參數(shù)資料
| 型號： | Embedded Pentium 233 |
| 廠商： | Intel Corp. |
| 英文描述： | 32 BIT Embedded Pentium Processor with MMX Technology(32位嵌入式帶MMX技術(shù)奔騰處理器) |
| 中文描述： | 32位嵌入式MMX技術(shù)（32位嵌入式帶MMX公司的技術(shù)奔騰處理器Pentium處理器） |
| 文件頁數(shù)： | 4/46頁 |
| 文件大?。?/td> | 944K |
| 代理商： | EMBEDDED PENTIUM 233 |
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Embedded Pentium
Processor with MMX Technology
4
Datasheet
6
7
8
9
10
11
12
13
14
Thermal Resistance vs. Heatsink Height, PPGA Packages ...............................31
Clock Waveform..................................................................................................43
Valid Delay Timings ............................................................................................43
Float Delay Timings ............................................................................................43
Setup and Hold Timings......................................................................................44
Reset and Configuration Timings........................................................................44
Test Timings........................................................................................................45
Test Reset Timings .............................................................................................45
50 Percent V
CC
Measurement of Flight Time......................................................46
Tables
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Pin Cross-Reference by Pin Name — Address and Data Pins...........................14
Pin Cross-Reference by Pin Name — Control Pins............................................15
Pin Cross-Reference by Pin Name — Power, Ground and No Connect Pins ....16
Quick Pin Reference ...........................................................................................17
Bus Frequency Selections ..................................................................................23
Output Pins .........................................................................................................24
Input Pins ............................................................................................................25
Input/Output Pins ................................................................................................26
Inter-processor Input/Output Pins .......................................................................26
Pin Functional Grouping......................................................................................27
PPGA Package Information ................................................................................28
PPGA Package Dimensions ...............................................................................28
Power Dissipation Requirements for Thermal Design ........................................29
Thermal Resistance for PPGA Packages ...........................................................31
Absolute Maximum Ratings ................................................................................35
V
CC
and T
CASE
Specifications ............................................................................36
3.3 V DC Specifications ......................................................................................36
ICC Specifications...............................................................................................36
Input and Output Characteristics.........................................................................37
AC Specifications................................................................................................38
Notes for Table 20...............................................................................................42
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