參數(shù)資料
型號: GE28F640W30B70
英文描述: EEPROM|FLASH|4MX16|CMOS|BGA|56PIN|PLASTIC
中文描述: 的EEPROM | FLASH動畫| 4MX16 |的CMOS | BGA封裝| 56PIN |塑料
文件頁數(shù): 90/91頁
文件大?。?/td> 994K
代理商: GE28F640W30B70
1.8 Volt Intel
Wireless Flash Memory with 3 Volt I/O
90
Datasheet
Figure 38. 128-Mbit VF BGA, 0.75 mm Ball Pitch, 7×8 Ball Matrix Package Drawing
Table 37. 32-Mbit and 64-Mbit Package Dimensions
Dimension
Symbol
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
Package Height
A
0.850
1.000
0.0335
0.0394
Ball Height
A
1
A
2
b
0.150
0.0059
Package Body Thickness
0.615
0.665
0.715
0.0242
0.0262
0.0281
Ball (Lead) Width
0.325
0.375
0.425
0.0128
0.0148
0.0167
Package Body Width (32Mb/64Mb)
D
7.600
7.700
7.800
0.2992
0.3031
0.3071
Package Body Width (128Mb)
D
12.400
12.500
12.600
0.4882
0.4921
0.4961
Package Body Length (32Mb/64Mb)
E
8.900
9.000
9.100
0.3503
0.3543
0.3583
Package Body Length (128Mb)
E
11.900
12.000
12.100
0.4685
0.4724
0.4764
Pitch
[e]
0.750
0.0295
Ball (Lead) Count (32Mb/64Mb)
N
56
56
Ball (Lead) Count (128Mb)
N
60
60
Seating Plane Coplanarity
Y
0.100
0.0039
Corner to Ball A1 Distance Along D (32Mb/64Mb)
S
1
S
1
S
2
S
2
1.125
1.225
1.325
0.0443
0.0482
0.0522
Corner to Ball A1 Distance Along D (128Mb)
2.775
2.875
2.975
0.1093
0.1132
0.1171
Corner to Ball A1 Distance Along E (32Mb/64Mb)
2.150
2.250
2.350
0.0846
0.0886
0.0925
Corner to Ball A1 Distance Along E (128Mb)
2.900
3.000
3.100
0.1142
0.1181
0.1220
Seating
Plane
Y
A
A1
A2
Note: Drawing not to scale
Side View
E
Top View - Bump Side
Down
Bottom View - Ball Side
Up
D
Ball A1
Corner
S1
S2
e
b
7
6
5
4
3
2 1
10
9
8
A
B
C
D
E
F
G
H
J
7
6
5
4
3
2
1
10
9
8
A
B
C
D
E
F
G
H
J
Ball A1
Corner
相關PDF資料
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