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參數(shù)資料
| 型號(hào)： | IDT79R4700-100G |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 100 MHz, RISC PROCESSOR, CPGA179 |
| 封裝： | PGA-179 |
| 文件頁數(shù)： | 4/25頁 |
| 文件大小： | 437K |
| 代理商： | IDT79R4700-100G |
IDT79R4700/RV4700
COMMERCIAL TEMPERATURE RANGE
12
STANDBY MODE OPERATIONS
The R4700 provides a means to reduce the
amount of power consumed by the internal core when
the CPU would otherwise not be performing any useful
operations. This is known as “Standby Mode.”
Entering Standby Mode
Executing the WAIT instruction enables interrupts
and enters Standby mode. When the WAIT instruction
finishes the W pipe-stage, if the SysAd bus is currently
idle, the internal clocks will shut down, thus freezing
the pipeline. The PLL, internal timer, some of the input
pin clocks (Int[5:0]*, NMI*, ExtReq*, Reset*, and Cold-
Reset*),
and
the
output
clocks—TClock[1:0],
RClock[1:0] SyncOut, Modeclock and MasterOut—will
continue to run. If the conditions are not correct when
the WAIT instruction finishes the W pipe-stage (such
as the SysAd bus is not idle), the WAIT is treated as a
NOP.
Once the CPU is in Standby Mode, any interrupt—
including the internally generated timer interrupt—will
cause the CPU to exit Standby Mode.
THERMAL CONSIDERATIONS
The R4700 uses special packaging techniques to
improve the thermal properties of high-speed proces-
sors. The R4700 is packaged using cavity down pack-
aging in a 179-pin PGA package with integral thermal
slug, and a 208-lead MQUAD QFP package. These
packages effectively dissipate the power of the CPU,
increasing device reliability.
The R4700 uses the MQUAD package (the “MS”
package), which is an all-aluminum package with the
die attached to a normal copper lead frame mounted to
the aluminum casing. Due to the heat-spreading effect
of the aluminum, the package allows for an efficient
thermal transfer between the die and the case. The
aluminum offers less internal resistance from one end
of the package to the other, reducing the temperature
gradient across the package and therefore presenting
a greater area for convection and conduction to the
PCB for a given temperature. Even nominal amounts of
airflow will dramatically reduce the junction tempera-
ture of the die, resulting in cooler operation.
The R4700 is guaranteed in a case temperature
range of 0
° to +85° C. The type of package, speed
(power) of the device, and airflow conditions affect the
equivalent ambient temperature conditions that will
meet this specification.
The equivalent allowable ambient temperature, TA, can
be calculated using the thermal resistance from case to
ambient (
CA) of the given package. The following equation
relates ambient and case temperatures:
TA = TC - P *
CA
where P is the maximum power consumption at hot
temperature, calculated by using the maximum ICC specifica-
tion for the device.
Typical values for
CA at various airflows are shown in
Table 5. Thermal Resistance (
CA) at Various Airflows
Note: The R4700 implements advanced power manage-
ment to substantially reduce the average power dissipation of
the device. This operation is described in the
IDT79R4600 &
R4700 ORION Processor Hardware User’s Manual.
CA
Airflow (ft/min)
0
200
400
600
800
1000
PGA
16
7
532.5
2
MQUAD
20
12
9876
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